The scope of review of this paper focused on the precuring underfilling flow stage of
encapsulation process. A total of 80 related works has been reviewed and being classified …

Flip-chip underfill process is a very important step in the flip-chip packaging technology
because of its great impact on the reliability of the electronic devices. In this technology …

Explores State-of-the-Art Work from the World's Foremost Scientists, Engineers, Educators,
and Practitioners in the FieldWhy use smart materials? Since most smart materials do not …

General underfill for the flip-chip package had a low thermal conductivity of about 0.2 W/mK.
Thermal properties of underfill were measured with various fillers, such as silica, alumina …

This article describes an analytical model for the prediction of the underfill flow
characteristics in a flip-chip package driven by capillary action. In this model, we consider …

This paper presents a new analytical filling time model to predict the flow of non-Newtonian
underfill fluid during flip-chip encapsulation process. The current model is formulated based …

An underfill encapsulant was used to fill the gap between the chip and substrate around
solder joints to improve the long-term reliability of flip chip interconnect systems. The …

In most bonding processes, an adhesive is applied to a substrate in a specific pattern before
the second substrate is subsequently pressed against it. During this, the adhesive flows in …

In this paper, the finite volume method (FVM) based numerical simulation is used for the flow
visualization of capillary driven underfill process for different solder bump arrangements of …

Purpose This paper aims to introduce a new indicative parameter of filling efficiency to
quantify the performance and productivity of the flip-chip underfill encapsulation process …