State of the art and future perspectives in advanced CMOS technology

HH Radamson, H Zhu, Z Wu, X He, H Lin, J Liu… - Nanomaterials, 2020 - mdpi.com
The international technology roadmap of semiconductors (ITRS) is approaching the
historical end point and we observe that the semiconductor industry is driving …

The challenges of advanced CMOS process from 2D to 3D

HH Radamson, Y Zhang, X He, H Cui, J Li, J Xiang… - Applied Sciences, 2017 - mdpi.com
The architecture, size and density of metal oxide field effect transistors (MOSFETs) as unit
bricks in integrated circuits (ICs) have constantly changed during the past five decades. The …

Nanowire & nanosheet FETs for ultra-scaled, high-density logic and memory applications

A Veloso, T Huynh-Bao, P Matagne, D Jang… - Solid-State …, 2020 - Elsevier
We report on vertically stacked lateral nanowires (NW)/nanosheets (NS) gate-all-around
(GAA) FET devices as promising candidates to obtain a better power-performance metric for …

Vertically stacked gate-all-around Si nanowire transistors: Key process optimizations and ring oscillator demonstration

H Mertens, R Ritzenthaler, V Pena… - 2017 IEEE …, 2017 - ieeexplore.ieee.org
We report on CMOS-integrated vertically stacked gate-all-around (GAA) Si nanowire (NW)
MOSFETs with in-situ doped source-drain stressors and dual work function metal gates. We …

Demonstration of a nanosheet FET with high thermal conductivity material as buried oxide: Mitigation of self-heating effect

S Rathore, RK Jaisawal, PN Kondekar… - IEEE Transactions on …, 2023 - ieeexplore.ieee.org
Self-heating-induced thermal degradation is a severe issue in nonplanar MOS architectures.
Especially in stacked gate-all-around (GAA) nanosheet FET (NSFET), the self-heating effect …

Layout design correlated with self-heating effect in stacked nanosheet transistors

L Cai, W Chen, G Du, X Zhang… - IEEE Transactions on …, 2018 - ieeexplore.ieee.org
With technology node scaling down to 5 nm, the narrow device geometry confines the
material thermal conductivity and further aggravates the self-heating effect in gate-all-around …

First demonstration of vertically stacked gate-all-around highly strained germanium nanowire pFETs

E Capogreco, L Witters, H Arimura… - … on Electron Devices, 2018 - ieeexplore.ieee.org
This paper reports on 45-nm fin pitch strained p-type Ge gate-all-around devices fabricated
on 300-mm SiGe strain-relaxed-buffers (SRB). By improving the process integration flow …

Strained germanium gate-all-around PMOS device demonstration using selective wire release etch prior to replacement metal gate deposition

L Witters, H Arimura, F Sebaai… - IEEE transactions on …, 2017 - ieeexplore.ieee.org
Strained Ge p-channel gate-all-around (GAA) devices with Si-passivation are demonstrated
on high-density 45-nm active pitch starting from 300-mm SiGe strain relaxed buffer wafers …

GAAFET versus pragmatic FinFET at the 5nm Si-based CMOS technology node

YC Huang, MH Chiang, SJ Wang… - IEEE Journal of the …, 2017 - ieeexplore.ieee.org
Speed and power performances of Si-based stacked-nanowire gate-all-around (GAA) FETs
and pragmatic ultra-thin-fin FETs at the 5nm CMOS technology node are projected …

On the vertically stacked gate-all-around nanosheet and nanowire transistor scaling beyond the 5 nm technology node

H Wong, K Kakushima - Nanomaterials, 2022 - mdpi.com
This work performs a detailed comparison of the channel width folding effectiveness of the
FinFET, vertically stacked nanosheet transistor (VNSFET), and vertically stacked nanowire …