[HTML][HTML] Second life potential of electric vehicle power electronics for more circular economies
As newer generations of electric vehicles get to market, more electric vehicles with out-of-
use components will emerge. Some of these electric vehicles will have components that no …
use components will emerge. Some of these electric vehicles will have components that no …
Gaining Confidence-A Review of Silicon Carbide's Reliability Status
N Kaminski, S Rugen… - 2019 IEEE International …, 2019 - ieeexplore.ieee.org
Silicon carbide has the potential to replace silicon in a large spectrum of applications. To do
so, SiC needs superior performance, a reasonable price and good reliability. However, there …
so, SiC needs superior performance, a reasonable price and good reliability. However, there …
Evaluation of the VSD‐method for temperature estimation during power cycling of SiC‐MOSFETs
F Hoffmann, N Kaminski - IET Power Electronics, 2019 - Wiley Online Library
An accurate temperature estimation is a substantial necessity to evaluate the outcome of a
power cycling test. For devices with a forward biased pn‐junction in the main current path …
power cycling test. For devices with a forward biased pn‐junction in the main current path …
Guideline for reproducible SiC MOSFET thermal characterization based on source-drain voltage
Y Zhang, Y Zhang, Z Xu, Z Wang… - IEEE Transactions …, 2024 - ieeexplore.ieee.org
This paper aims to provide a guideline with respect to a reproducible thermal transient
measurement for SiC MOSFETs. Although the thermal transient measurement based on …
measurement for SiC MOSFETs. Although the thermal transient measurement based on …
Figures-of-Merit Study for Thermal Transient Measurement of SiC MOSFETs
Thermal transient measurement (TTM) utilizes temperature-sensitive electrical parameters
(TSEP) to analyze the thermal structure of power semiconductor devices. However, the …
(TSEP) to analyze the thermal structure of power semiconductor devices. However, the …
A guideline for silicon carbide MOSFET thermal characterization based on source-drain voltage
Thermal transient measurement based on source-drain voltage is a standard method to
characterize thermal properties of silicon semiconductors but is doubtful to be directly …
characterize thermal properties of silicon semiconductors but is doubtful to be directly …
Investigation on effects of thermal stress on SiC MOSFET degradation through power cycling tests
Silicon carbide (SiC) MOSFET reliability becomes crucial to their widespread applications.
Many works have been conducted on SiC MOSFET to analyze the degradation of bond …
Many works have been conducted on SiC MOSFET to analyze the degradation of bond …
A method for the measurement of the threshold-voltage shift of SiC MOSFETs during power cycling tests
C Kempiak, A Lindemann - IEEE Transactions on Power …, 2020 - ieeexplore.ieee.org
The application of established test routines like power cycling to wide bandgap devices may
be not as straightforward as it seems: When power cycling silicon carbide MOSFETs, the …
be not as straightforward as it seems: When power cycling silicon carbide MOSFETs, the …
Impact of Threshold Voltage Instabilities of SiC MOSFETs on the Methodology of Power Cycling Tests
C Kempiak, A Lindemann - PCIM Europe digital days 2021; …, 2021 - ieeexplore.ieee.org
When power cycling SiC MOSFETs steep temperature gradients intendedly lead to thermo-
mechanical stress degrading the package. The observation of package degradation …
mechanical stress degrading the package. The observation of package degradation …
Challenges of junction temperature sensing in SiC power MOSFETs
JO Gonzalez, O Alatise - … on Power Electronics and ECCE Asia …, 2019 - ieeexplore.ieee.org
Junction temperature sensing is an integral part of both on-line and off-line condition
monitoring where direct access the bare die surface is not available. Given a defined power …
monitoring where direct access the bare die surface is not available. Given a defined power …