A comprehensive study of short-circuit ruggedness of silicon carbide power MOSFETs

G Romano, A Fayyaz, M Riccio… - IEEE Journal of …, 2016 - ieeexplore.ieee.org
The behavior of silicon carbide (SiC) power MOSFETs under stressful short-circuit (SC)
conditions is investigated in this paper. Two different SC failure phenomena for SiC power …

Modeling of wide bandgap power semiconductor devices—Part I

HA Mantooth, K Peng, E Santi… - IEEE Transactions on …, 2014 - ieeexplore.ieee.org
Wide bandgap power devices have emerged as an often superior alternative power switch
technology for many power electronic applications. These devices theoretically have …

Circuit models of power MOSFETs leading the way of GaN HEMT modelling—A review

E Bottaro, SA Rizzo, N Salerno - Energies, 2022 - mdpi.com
Gallium nitride high-electron-mobility transistor (GaN HEMT) is a key enabling technology
for obtaining high-efficient and compact power electronic systems. At the design stage of a …

Short-circuit failure mechanism of SiC power MOSFETs

G Romano, L Maresca, M Riccio… - 2015 IEEE 27th …, 2015 - ieeexplore.ieee.org
Failure mechanisms during short-circuit conditions of Silicon Carbide Power MOSFETs are
analysed in this work, and a possible theoretical explanation is provided. Insight into the …

A temperature-dependent SPICE model of SiC power MOSFETs for within and out-of-SOA simulations

M Riccio, V d'Alessandro, G Romano… - … on power electronics, 2017 - ieeexplore.ieee.org
This paper presents a temperature-dependent SPICE model for SiC power MOSFETs. The
model describes the static and dynamic behavior and accounts for leakage current and …

A physics-based compact model of SiC power MOSFETs

R Kraus, A Castellazzi - IEEE Transactions on Power …, 2015 - ieeexplore.ieee.org
The presented compact model of SiC power MOSFETs is based on a thorough
consideration of the physical phenomena which are important for the device characteristics …

Comparison and analysis of short circuit capability of 1200V single-chip SiC MOSFET and Si IGBT

J Sun, H Xu, X Wu, K Sheng - 2016 13th China International …, 2016 - ieeexplore.ieee.org
Short circuit capability of commercial SiC MOSFETs is analyzed, which is compared with that
of commercial Si IGBTs. Junction temperatures during short circuit tests are analyzed in this …

Circuit-based electrothermal simulation of power devices by an ultrafast nonlinear MOR approach

L Codecasa, V d'Alessandro… - IEEE Transactions on …, 2015 - ieeexplore.ieee.org
This paper presents an efficient circuit-based approach for the nonlinear dynamic
electrothermal simulation of power devices and systems subject to radical self-heating. The …

[HTML][HTML] Compact modeling of a 3.3 kv sic mosfet power module for detailed circuit-level electrothermal simulations including parasitics

C Scognamillo, AP Catalano, M Riccio, V d'Alessandro… - Energies, 2021 - mdpi.com
In this paper, an advanced electrothermal simulation strategy is applied to a 3.3 kV silicon
carbide MOSFET power module. The approach is based on a full circuital representation of …

Computational Efficiency Analysis of SiC MOSFET Models in SPICE: Static Behavior

BW Nelson, AN Lemmon, BT DeBoi… - IEEE Open Journal …, 2020 - ieeexplore.ieee.org
Transient simulation of complex converter topologies is a challenging problem, especially in
detailed analysis tools like SPICE. Much of the recent literature on SPICE transistor …