Substrate is described comprising the Steps of forming a Semiconductor layer on a Seed
wafer Substrate containing an at least partially crystalline porous release layer, processing …

The present invention provides a method of transfer of a first planar Substrate with two major
Surfaces to a Second Substrate, comprising the Steps of forming the first planar Substrate …

An object is to realize high performance and low power consumption in a semiconductor
device having an SOI struc ture. In addition, another object is to provide a semiconductor …

A semiconductor device is demonstrated in which a plurality of field-effect transistors is
stacked with an interlayer insulating layer interposed therebetween over a substrate having …

A method of forming a multi-layer semiconductor structure includes attaching a handle-
member to a top surface of a first structure using a first interface. At least one region of a …

2. Description of the Related Art Modern semiconductor circuits often integrate circuit types
or components, such as transistors, resistors and capaci tors, for which different types of …

An integrated circuit design, structure and method for fabri cation thereof includes at least
one logic device layer and at least two additional separate memory array layers. Each of the …

An integrated circuit design, structure and method for fabri cation thereof includes at least
one logic device layer and at least two additional separate memory array layers. Each of the …

3,888,708 A 6, 1975 Wise et al. 5,877,516 A 3/1999 Mermagen et al. 4.416, 054 A 11, 1983
Thomas et al. 5,880,010 A 3, 1999 Davidson 4,500,905 A 2/1985 Shibata …

US10515981B2 - Multilevel semiconductor device and structure with memory - Google
Patents US10515981B2 - Multilevel semiconductor device and structure with memory …