Solder joint, crucial component in electronic systems, face significant challenges when
exposed to extreme conditions during applications. The solder joint reliability involving …

High-lead solder joints are still playing an indispensable role in military and space
applications. Nevertheless, in-depth characterization of high-lead solder joints and the …

This research explores the effects of incorporating Graphene Nano Sheets (GNS) on the
microstructural characteristics and mechanical behavior of Sn–Ag solder alloys. The …

Fire smoke could induce serious corrosion damage to electronic equipment away from the
fire, causing significant economic losses. And lead-free solders used for chip package is the …

The effect of Zn on the microstructure, melting characteristics and mechanical properties of
Sn–Bi-based lead-free solder was studied in this study. Results show that the microstructure …

Solder joints are generally the weakest part in electronic packaging structure whose fatigue
life depends to a large extent on the durability of solder joints. In pursuit of a balance …

The 42 wt.% Sn–58 wt.% Bi (Sn-58Bi) Ball Grid Array (BGA) solder balls were mounted to
electroless nickel-electroless palladium-immersion gold (ENEPIG) pads by employing the …

Deep understanding of and effective improvement in interconnect performance are of great
significance for developing miniaturized and high-performance microwave modules. Herein …

The effects of temperature and ultrasonic-assisted time on the microstructures and
mechanical properties of the electroless nickel-immersion gold (ENIG)/Sn-3.5 Ag/ENIG …

Abstract Cu/Sn–Pb multilayer composite was fabricated by accumulative roll bonding (ARB)
technique and its structural, mechanical, and corrosion properties were studied …