Interdiffusion along grain boundaries can lead to shift of grain boundaries in form of Grain
Boundary Diffusion Induced Grain Boundary Migration, DIGM, in systems forming wide …

Copper wires are increasingly used in place of gold wires for making bonded
interconnections in microelectronics. There are many potential benefits for use of copper in …

Heat treatments performed on copper-clad aluminium thin wires increase the ductility of
copper and aluminium but activate diffusion between both layers, creating brittle …

Öttinger's recent nontraditional incorporation of fluctuations into the formulation of the friction
matrix appearing in the phenomenological GENERIC theory of nonequilibrium irreversible …

Study of the solid-state diffusion between copper and aluminum was carried out in the
temperature range [573–673] K in order to better understand the aging mechanisms which …

The microstructure evolution of the interdiffusion zone (IDZ), secondary reaction zone (SRZ),
and substrate diffusion zone (SDZ) formed beneath the coating/substrate interface in a …

Diffusion on the nano/atomic scales in multilayers, thin films has many challenging features
even if the role of structural defects (grain-boundaries, dislocations, etc.) can be neglected …

Abstract Ni-Cr-B-Si alloys, as alternative alloys for Co-based alloys, are expected to be used
in pump in nuclear power plants owing to their excellent wear resistance and lower dose …

The oxidation process of non-oxide ceramics (NOCs) is accompanied with the formation of
the compressive stress generated within the oxide film, which in turn affects the oxidation …

The Kirkendall effect stems from unequal mobilities of atomic species, which give rise to a
net flux of vacancies during interdiffusion in substitutional alloys. In this work, we study a …