This review article presents the current status of various micromachining techniques used to
create microfeatures in alumina ceramic. Alumina has emerged as an advanced substrate in …

The utilization of array micro-holes is becoming increasingly prevalent across a range of
industries, including aerospace, automotive, electronics, medical and chemical. Advanced …

This article addresses the gas bubble entrapment issue for the first time when a multi-tip tool
array (MTA) is used in electrochemical discharge machining (ECDM). During the …

Due to the unstable gas film, it is still a big challenge to achieve high repeatability and
quality in electrochemical discharge machining (ECDM) of micro-hole arrays in glass. Based …

This article reports the improvement of the adhesion of the electroless seed layer deposited
on glass substrates used in creating through-glass vias (TGV) by localized surface …

The void-free filling of high-density low aspect ratio (AR≤ 5) through holes (THs) in the
packaging substrate is beneficial for promoting the integration, reliability, and heat …

The formation of 3D copper-filled microstructures in glass using direct writing
electrochemical discharge machining (ECDM) and electrodeposition techniques is …

This study introduces a novel approach involving the utilization of electrochemical
discharges (ECD) to roughen a glass substrate to enhance the electroless metalization …

This study presents the crucial process of achieving conformal electroless seed layer
deposition within blind glass vias. A cost-effective and room-temperature-based ultrasonic …

A dynamic impact-based numerical model is presented to estimate the cross-sectional
profiles of deep vias having depths up to 1 mm, created in glass by ultrasonic …