Until now, the determination of microelectronic packages hermeticity has been related to the
MIL-STD-883 method 1014 which is based on the helium leak detection method. But this …

This paper presents an innovative and effective method of measuring the internal vacuum
quality of un-cooled micro bolometer thermal imager sensors where the bolometer sensor …

A vacuum-controlled wafer-level packaging process for micromechanical devices was
developed. The process includes a thick titanium deposition process and a vacuum anodic …

In this paper, the bulge test is used to determine the mechanical properties of very thin
dielectric membranes. Commonly, this experimental method permits to determine the …

This paper reviews the current state of art of vacuum encapsulation of microsystems.
Different types of bonding techniques and “integrated sealing process” are described. It is …

This paper presents hermetic packaging for MEMS with integrated temperature and
pressure sensors based on Silicon On Insulator technology. Temperature and pressure are …

Since the 1990s, optical profilers based on interference microscopy techniques are the most
widely used characterization tools for fast and high-resolution three-dimensional topography …

The first works on the development of the directions of biomedical optics in Belarus were
studied by LV Tanin in 1975. Soon the urgency of this direction became clear, and due to …

L 'encapsulation fait partie intégrante du processus de fabrication des circuits
microélectroniques. Son rôle est de protéger le composant vis-à-vis de son environnement …

In this paper, simulation result of MEMS based micro-hotplate using the finite element
method (FEM) has been presented. FEM subdivides a large problem into smaller, simpler …