As the semiconductor industry faces serious challenges extending the CMOS roadmap,
traditional cost reduction benefits that accompanied power/performance/area (PPA) …

In this chapter, the advantages and limitations of 3D architectures are discussed to provide
context for why 3D stacking is a key area of interest for product architects, why it has …

We present electrical and thermal analyses of 3D digital designs using hybrid bonding,
specifically using the design rules, and other properties, for the XPERI DBI® technology at a …

3D technologies offer significant potential to improve total performance and performance per
unit of power. After exploiting TSV technologies for cost reduction and increasing memory …

As the semiconductor industry continues to drive the CMOS scaling roadmap, traditional cost
reduction and the accompanied power/performance/area (PPAC) advantages of successive …

Variability is a challenge for future scaling as process dimensions reduce. The emerging 3-D
sequential stacking technology is more than Moore's scaling alternative. The 3-D design …

2.5 D and 3D technologies can give rise to a node equivalent of scaling due to improved
connectivity. Aggressive exploitation scenarios include functional partitioning, circuit …

Ubiquitous mobile communication creates an increasing demand for high data rates,
complex modulation schemes and low power design. The cost and performance benefits of …

Summary 3D‐IC and interposer technologies have demonstrated their capability to reduce
system size and weight, improve performance, reduce power consumption, and even …

Scaling limitations of advanced technology nodes are increasing and the BEOL parasitics
are becoming more dominant. This has led to an increasing interest in 3D technologies to …