A review of recent advances in thermal management in three dimensional chip stacks in electronic systems
V Venkatadri, B Sammakia, K Srihari, D Santos - 2011 - asmedigitalcollection.asme.org
Three dimensional (3D) integration offers numerous electrical advantages like shorter
interconnection distances between different dies in the stack, reduced signal delay, reduced …
interconnection distances between different dies in the stack, reduced signal delay, reduced …
Thermal modeling, analysis, and management in VLSI circuits: Principles and methods
M Pedram, S Nazarian - Proceedings of the IEEE, 2006 - ieeexplore.ieee.org
The growing packing density and power consumption of very large scale integration (VLSI)
circuits have made thermal effects one of the most important concerns of VLSI designers …
circuits have made thermal effects one of the most important concerns of VLSI designers …
[图书][B] Three-dimensional integrated circuit design
Three-Dimensional Integrated Circuit Design, Second Eition, expands the original with more
than twice as much new content, adding the latest developments in circuit models …
than twice as much new content, adding the latest developments in circuit models …
[图书][B] Microelectronic applications of chemical mechanical planarization
Y Li - 2007 - books.google.com
An authoritative, systematic, and comprehensive description of current CMP technology
Chemical Mechanical Planarization (CMP) provides the greatest degree of planarization of …
Chemical Mechanical Planarization (CMP) provides the greatest degree of planarization of …
Integrated microchannel cooling for three-dimensional electronic circuit architectures
JM Koo, S Im, L Jiang… - J. Heat …, 2005 - asmedigitalcollection.asme.org
The semiconductor community is developing three-dimensional circuits that integrate logic,
memory, optoelectronic and radio-frequency devices, and microelectromechanical systems …
memory, optoelectronic and radio-frequency devices, and microelectromechanical systems …
A survey of chip-level thermal simulators
H Sultan, A Chauhan, SR Sarangi - ACM Computing Surveys (CSUR), 2019 - dl.acm.org
Thermal modeling and simulation have become imperative in recent years owing to the
increased power density of high performance microprocessors. Temperature is a first-order …
increased power density of high performance microprocessors. Temperature is a first-order …
Full chip thermal analysis of planar (2-D) and vertically integrated (3-D) high performance ICs
S Im, K Banerjee - … Meeting 2000. Technical Digest. IEDM (Cat …, 2000 - ieeexplore.ieee.org
This work presents a full chip thermal analysis of 2-D high performance ICs based on
technological, structural, and material data from ITRS'99. It is shown that interconnect Joule …
technological, structural, and material data from ITRS'99. It is shown that interconnect Joule …
Analytical and numerical modeling of the thermal performance of three-dimensional integrated circuits
A Jain, RE Jones, R Chatterjee… - IEEE Transactions on …, 2009 - ieeexplore.ieee.org
Three-dimensional (3D) interconnection technology offers several electrical advantages,
including reduced signal delay, reduced interconnect power, and design flexibility. 3D …
including reduced signal delay, reduced interconnect power, and design flexibility. 3D …
Interconnect-based design methodologies for three-dimensional integrated circuits
VF Pavlidis, EG Friedman - Proceedings of the IEEE, 2009 - ieeexplore.ieee.org
Design techniques for three-dimensional (3-D) ICs considerably lag the significant strides
achieved in 3-D manufacturing technologies. Advanced design methodologies for two …
achieved in 3-D manufacturing technologies. Advanced design methodologies for two …
Thermal characterization of interlayer microfluidic cooling of three-dimensional integrated circuits with nonuniform heat flux
It is now widely recognized that the three-dimensional (3D) system integration is a key
enabling technology to achieve the performance needs of future microprocessor integrated …
enabling technology to achieve the performance needs of future microprocessor integrated …