Package Design Through Reliable Predictive Modeling and Its Validation

P Yin, S Park, B Jacob, L Yin… - 2022 IEEE 72nd …, 2022 - ieeexplore.ieee.org
The outer packing of electronic products plays a significant role in keeping inner electronics'
functionality. The different designs and materials of outer packing would decrease or isolate …

Enhanced Foam Package Design for Drop/Impact Using Accurate Predictive Simulation

P Yin, S Park, B Jacob, A Gowda - IEEE Transactions on …, 2023 - ieeexplore.ieee.org
The interconnections and chips of the internal components of electronic devices need to be
protected to prevent damage during shipping, handling, and daily use. This article studied …

Ionic Sensor Package Design for the Survivability in a Drop/Impact During Deployment

P Yin, J Ha, J Yang, Y Lai, S Park… - 2023 IEEE 73rd …, 2023 - ieeexplore.ieee.org
By utilizing different outer package designs and materials, it is possible to reduce or isolate
impact energy, which can prevent damage or destruction of interconnections and chips that …

Evaluation Airborne Drop Survivability of Electronic Packages

P Yin - 2024 - search.proquest.com
Three types of radiation detectors usually can be found in the market: gas-filled detectors,
scintillation detectors, and solid-state detectors. The ion-chamber type of gas-filled was …

Evaluation of Reliability of Low Melting Temperature Sn-Bi Solder

C Cai - 2022 - search.proquest.com
Lead-free SAC solder pastes have been widely used in electronic packages. To reduce the
reflow energy cost, low melting temperature solder alloys are now receiving more attention …

낙하시험에대한컨테이너의안전성평가

정윤아, 정선우, 허장욱 - 한국기계가공학회지, 2024 - dbpia.co.kr
This study aims to verify the design and performance of containers intended for the rapid
and safe transportation of critical equipment in transportation environments. Specifically …