Improved methodology for parasitic characterization of high-performance power modules

BT DeBoi, AN Lemmon, BW Nelson… - … on Power Electronics, 2020 - ieeexplore.ieee.org
The accelerating commercialization of wide bandgap technology has led to increased
demand for accurate characterization of parasitic impedances within packaging structures …

Integrated Rogowski coil sensor for press-pack insulated gate bipolar transistor chips

C Jiao, Z Zhang, Z Zhao, X Zhang - Sensors, 2020 - mdpi.com
Recently, the press-pack insulated gate bipolar transistor (IGBT) has usually been used in
direct current (DC) transmission. The press-pack IGBT (PPI) adopts a parallel layout of boss …

Optimization algorithms for dynamic tuning of wide bandgap semiconductor device models

W Collings, T Nelson, A Sellers… - 2021 IEEE Applied …, 2021 - ieeexplore.ieee.org
Circuit and device parasitics have an outsized effect on the switching voltage and current
waveforms of wide bandgap semiconductors. The variation of these parasitic components …

Optimized design of current, temperature and stress distributions among paralleled chips in press-pack IGBT module

L Han, L Liang, Y Kang - CSEE Journal of Power and Energy …, 2022 - ieeexplore.ieee.org
In Press-Pack IGBT, compact packaging structure forms the strong electromagnetic coupling,
thermal coupling and stress coupling, threatening current sharing, temperature sharing and …

Condition Monitoring of Multi-chip Parallel Presspack IGBT Devices Based on Current Distribution

Z Deng, M Chen, Y Wei, W Lai, H Li… - … on HVDC (HVDC), 2020 - ieeexplore.ieee.org
Press-pack IGBTs (PPI) are key components in flexible DC transmission converter valves
due to its advantages of compact structure, short circuit failure, and high power density …

Effect and Resolution of Parasitic Inductance of on Current Sharing for Parallel SiC MOSFETs

H Liu, W Cao, Z Yan, K Tan, C Hu, L Sun - International Symposium on …, 2022 - Springer
SiC MOSFETs are gaining in popularity due to their excellent performance. In the
applications of high voltage and high current power converters, a multi-chip parallel method …