During the past decades, series of lead-free solders have been developed rapidly, and are
considered as the attractive interconnection materials replacing traditional Sn-Pb solders in …

Abstract Pulsated Orifice Ejection Method (POEM) is a typical containerless heat transfer
and solidification process for the preparation of micron-sized spherical particles. The heat …

Cu-cored solder interconnects have been demonstrated to increase the performance of
interconnect structures, while the quantitative understanding of the effect of the Cu-cored …

Gallium nitride (GaN) power devices have many benefits, including high power density,
small footprint, high operating voltage, and excellent power gain capability. However, in …

In this study, we present a facile method for preparing oxidation-resistant Cu nanoparticles
through a liquid-phase reduction with imidazole compounds (imidazole, 2-methylimidazole …

The construction of accurate constitutive equations is critical for the reliability analysis of the
solder joints in high-density interconnect. However, there are some distinct differences …

As a thermal interface material, diamond/GaInSn composites have wide-ranging application
prospects in the thermal management of chips. However, studies on systematic reliability …

多层多元复合微球具有硬度高, 导电导热性好, 可靠性高等优异性能, 是解决三维高密度微电子
产品在长期服役条件下互连可靠性问题的一类关键电子材料, 其制备技术主要包括合金偏析 …

Abstract Pulsated Orifice Ejection Method (POEM) is a typical containerless heat transfer
and solidification process for preparing micron-sized spherical particles. The heat transfer …

According to the theory of elastic–plastic mechanics, the stress and deformation of a die
attach structure under a temperature load were studied. An analytical relation between the …