[图书][B] Encyclopedia of aluminum and its alloys, two-volume set (print)

GE Totten, M Tiryakioglu, O Kessler - 2018 - taylorfrancis.com
This encyclopedia, written by authoritative experts under the guidance of an international
panel of key researchers from academia, national laboratories, and industry, is a …

Microstructure evolution, IMC growth, and microhardness of Cu, Ni, Ag-microalloyed Sn–5Sb/Cu solder joints under isothermal aging

M Xin, X Wang, F Sun - Journal of Materials Science: Materials in …, 2022 - Springer
In this work, various Cu, Ni, Ag-microalloyed Sn–5Sb/Cu joints, ordinary Sn–5Sb/Cu joints,
and low-melting-point Sn–3Ag–0.5 Cu (SAC305)/Cu (used for comparison) were prepared …

Combination of enhanced strength-ductility trade-off and stress relaxation resistance of MWCNTs reinforced Sn–5Sb-0.3 Cu matrix composite

AA El-Daly, NAM Eid, AA Ibrahiem - Materials Chemistry and Physics, 2023 - Elsevier
In this study, the strength-ductility trade-off and stress relaxation (SR) behavior of Sn–5Sb-
0.3 Cu (SSC503) alloy reinforced with (0, 0.05 and 0.1 wt%) multi-walled carbon nanotubes …

Challenges and progress in packaging materials for power modules with high operation temperature

S Zhao, Y Tong, C Wang, E Yao - Journal of Materials Science: Materials …, 2024 - Springer
Power semiconductor modules are increasingly applied in the electrical power conversion
system, whose development has been characterized by increasing power density and …

Interconnection of Zn content, macrosegregation, dendritic growth, nature of intermetallics and hardness in directionally solidified Mg–Zn alloys

NC Verissimo, C Brito, WLR Santos, N Cheung… - Journal of Alloys and …, 2016 - Elsevier
Mg and Mg-based alloys are lightweight metallic materials that are extremely biocompatible
and have promising mechanical properties. Mg–Zn alloys have potential applications as …

A comparative analysis of microstructural features, tensile properties and wettability of hypoperitectic and peritectic Sn-Sb solder alloys

M Dias, TA Costa, BL Silva, JE Spinelli… - Microelectronics …, 2018 - Elsevier
Sn-Sb alloys are among the current alternatives for the development of alloys for high-
temperature lead-free solders. The Sn-Sb alloys having 5.5 wt.% Sb or less are known to …

Evolution of solidification structure, primary phase and wear properties of Sn–11wt% Sb alloy ingots under permanent magnet stirring

W Wang, J Peng, J Zeng, C Zhu, Y Yang… - Philosophical …, 2021 - Taylor & Francis
An experimental investigation has been conducted with respect to the influence of
permanent magnet stirring (PMS) under different rotation speeds (0, 60, 120, 180 rpm) on …

Thermal conductance at Sn-0.5 mass% Al solder alloy/substrate interface as a factor for tailoring cellular/dendritic growth

R Oliveira, C Cruz, A Barros, F Bertelli… - Journal of Thermal …, 2022 - Springer
The use of Al for replacing high-cost alloying metals, like Ag, Bi, and Cu, as the second
major element in Sn-based alloys, arises as a promising alternative for the development of …

Transition from high cooling rate cells to dendrites in directionally solidified Al-Sn-(Pb) alloys

R Oliveira, TA Costa, M Dias, C Konno… - Materials Today …, 2020 - Elsevier
The preprogramming of the solidification cooling rate during casting of some Al-based
bearing materials, has been used to achieve microstructural patterns conducive to better …

Thermal parameters and microstructural development in directionally solidified Zn-rich Zn-Mg alloys

TA Vida, ES Freitas, C Brito, N Cheung… - … Materials Transactions A, 2016 - Springer
Transient directional solidification experiments have been carried out with Zn-Mg
hypoeutectic alloys under an extensive range of cooling rates with a view to analyzing the …