Effects of voids on mechanical and thermal properties of the die attach solder layer used in high-power LED chip-scale packages
High-power light-emitting diode (LED) chip-scale packages (CSPs) prepared by the flip-chip
technology have become one of the most promising light sources. The die attach solder …
technology have become one of the most promising light sources. The die attach solder …
Effect of Heating Power on Ball Grid Array Thermal Shock Reliability for a Fanout Package
K Zhong, H Wang, J Wang, Y Xu - Journal of …, 2024 - asmedigitalcollection.asme.org
The reliability of Fanout package with a ball grid array (BGA) for microsystem is studied
under thermal shock. Different heat source powers are applied to the silicon substrate to …
under thermal shock. Different heat source powers are applied to the silicon substrate to …
Finite element analysis for Safe design of a flexible microelectronic system under bending deformation
We modeled flexible microelectronic systems and analyzed the stress and strain distribution
assuming an international standard bending test evaluating flexible electronics. The flexible …
assuming an international standard bending test evaluating flexible electronics. The flexible …
Thermo-mechanical deformation in flexible-board assemblies during reflow and post-assembly usage
Flexible printed circuit boards lack the structural stiffness of the rigid printed circuit
counterparts. Thermo-mechanical deformation in flexible printed circuit assemblies may be …
counterparts. Thermo-mechanical deformation in flexible printed circuit assemblies may be …
Thermal management of 3D RF PoP based on ceramic substrate
F Hou, F Liu, Y He, X Wu, X Zhang… - 2014 IEEE 64th …, 2014 - ieeexplore.ieee.org
In this paper, a new high performance three dimensional radio frequency package on
package (3D RF PoP) based on ceramic substrate is designed for micro base station which …
package (3D RF PoP) based on ceramic substrate is designed for micro base station which …
Control of position of neutral line in flexible microelectronic system under bending stress
A flexible electronic device deformed by external force causes the failure of a semiconductor
die. Even without failure, the repeated elastic deformation changes carrier mobility in the …
die. Even without failure, the repeated elastic deformation changes carrier mobility in the …
Simulation study on thermomechanical reliability in embedded die package fabrication process
Z Zhou, H Fan, Y Shi - 2021 22nd International Conference on …, 2021 - ieeexplore.ieee.org
EDP (Embedded Die Package) is promising in future years to become the key technology for
power electronics because of its compact layer structure fulfilling integration requirements …
power electronics because of its compact layer structure fulfilling integration requirements …
Reliability Design of a X-Band 2× 2 Tile-Type T/R Module under Thermal Shock and Random Vibration
H Wang, J Wang, Y Xu - 2020 IEEE International Conference …, 2020 - ieeexplore.ieee.org
With the further miniaturization of RF systems, its reliability has become one of the key
factors. In this paper, the reliability of a X-band 2× 2 tile-type module with ball grid array …
factors. In this paper, the reliability of a X-band 2× 2 tile-type module with ball grid array …
Fatigue damage assessment of LED chip scale packages with finite element simulation
As one of solid state lighting sources, wafer-level chip scale Light Emitting Diode (LED)
packages has gained much attention, because of its compact size, high power and high …
packages has gained much attention, because of its compact size, high power and high …
[PDF][PDF] Warpage of flexible-board assemblies with bags during reflow and post-assembly usage
Flexible printed circuit boards lack the structural stiffness of the rigid printed circuit
counterparts. Thermo-mechanical deformation in flexible printed circuit assemblies may be …
counterparts. Thermo-mechanical deformation in flexible printed circuit assemblies may be …