The semiconductor industry is experiencing a significant shift from traditional methods of
shrinking devices and reducing costs. Chip designers actively seek new technological …

System-in-package (SiP) is a type of electronic packaging convention that integrates
multiple components, such as microprocessors, memory, sensors, and so on, in the form of …

The semiconductor industry has adopted heterogeneous integration (HI), incorporating
modular intellectual property (IP) blocks (chiplets) into a unified system-in-package (SiP) to …

Recent decades have witnessed a remarkable pace of innovation and performance
improvements in integrated circuits (ICs), which have become indispensable in an array of …

Due to the global offshore fabrication of semiconductors, hardware security problems such
as counterfeit ICs and Hardware Trojans (HTs) have affected semiconductor device …

Battery-operated applications have been ubiquitous all over the world ranging from power-
intensive electric cars down to low-power smart terminals and embedded devices …

The rapid advancement of deep neural networks (DNNs) has necessitated exploring
emerging technologies. In addition, the growing significance of security arises from the …

Integrating heterogeneous components in multi-chiplet packaging, known as system-in-
package (SiP), is a significant step forward in overcoming limitations by Moore's Law and …

Heterogeneous integration (HI) is paving the way toward unforeseen efficiency in three
driving aspects of semiconductor engineering: performance, area, and yield. System-in …

The semiconductor industry is entering a new age in which device scaling and cost
reduction will no longer follow the decades-long pattern. Packing more transistors on a …