The urgent need for ultrahigh thermally conductive materials to keep up with the rapid
development of the electronics industry has led to the exploration of hexagonal boron nitride …

This article reviews recent fabrication methods for surface‐enhanced Raman spectroscopy
(SERS) substrates with a focus on advanced nanoarchitecture based on noble metals with …

The epoxy (EP) resin is being intensively applied in electronics packaging, the 5th
generation communication technology (5G) and composite tanks for pressurized hydrogen …

Fire warning sensor capable of rapidly monitoring critical fire risk of combustible materials
growingly plays a crucial role in reducing or avioding fire disaster under complicated …

A multifunctional polyurethane film (PU) with superior electromagnetic shielding
performance, joule heating performance, thermal conductivity and flame retardancy has …

Mechanochemistry with solvent‐free and environmentally friendly characteristics is one of
the most promising alternatives to traditional liquid‐phase‐based reactions, demonstrating …

In the field of modern microelectronic packaging materials, there is a great need for polymer-
based composites with both excellent thermal conduction and flame retardancy properties …

Flexible cellulose-based conductive films reveal high potential in electromagnetic
interference (EMI) shielding and thermal management applications. However, the high …

Hexagonal boron nitride (hBN)-based nanomaterials stand out as promising materials with
many excellent physicochemical, mechanical, and biological properties. The super high …

In order to improve the fire safety of epoxy resin, ZIF-8 nanoparticle in-situ decorated boron
nitride nanosheet (BN-OH/ZIF-8) is fabricated via self-assembly method and then ternary …