Performance evaluation of RF novel microstrip lines printed on flexible substrates

AS Obeidat, M Alhendi, MY Abdelatty… - 2023 IEEE 73rd …, 2023 - ieeexplore.ieee.org
Additive manufacturing or direct write printing is an attractive way to fabricate electronics due
to potentially lower cost, volume production, fast turnout, and less generated waste. RF …

Guidelines and Experimental Hydraulic performance Evaluation for Single-Phase CDUs Under Steady and Transient Events

A Heydari, AR Gharaibeh, M Tradat… - 2023 22nd IEEE …, 2023 - ieeexplore.ieee.org
About 40% of the energy utilized in data centers is used for cooling systems, and this
percentage has increased significantly in recent years. Data center server racks receive …

An investigation of multi-parameters effects on the performance of liquid-to-liquid heat exchangers in rack level cooling

A Heydari, Q Soud, M Tradat… - 2023 22nd IEEE …, 2023 - ieeexplore.ieee.org
As the demand for faster and more reliable data processing is increasing in our daily lives,
the power consumption of electronics and, correspondingly, Data Centers (DCs), also …

Planar SiC Power Module Packaging and Interconnections Using Direct Ink Writing

R Al-Haidari, M Alhendi, D Richmond… - 2023 IEEE 73rd …, 2023 - ieeexplore.ieee.org
Traditional device packaging becomes a limiting factor in realizing the full performance
potential of SiC. Thus, improved and advanced packaging technologies are required to …

High stability and reliability additively manufactured metal-insulator-metal capacitors for high-temperature applications

F Alshatnawi, E Enakerakpo, M Alhendi… - Materials Today …, 2024 - Elsevier
Throughout the last few years, there has been a significant increase in demand for high-
temperature capacitors due to the rising need for electronics in harsh environments …

Additive Manufacturing of Radio Frequancy (RF) Components on Flexible Substrates

AS Obeidat - 2022 - search.proquest.com
Additive manufacturing is an attractive technique in electronic fabrication due to material
savings and lower cost of processing. Microstrip lines are used for communication and …

Modeling and Additive Manufacturing of Inductors in Complex Geometries for High Temperature Electronics

WT Alshaibani, A Umar, F Alshatnawi… - 2024 IEEE 74th …, 2024 - ieeexplore.ieee.org
High-temperature electronic circuits are becoming increasingly important in a variety of
commercial applications, particularly in extreme high-temperature environments. These …

Embedded RF Packaging Via Ceramic 3D Printing and Printed Electronics Additive Manufacturing

AS Obeidat, A Umar, Z Dou… - 2024 IEEE 74th …, 2024 - ieeexplore.ieee.org
The demand for advanced, high-performance radio frequency (RF) systems continues to rise
in a wide range of applications, and embedded packaging is becoming a critical enabler for …

Novel SiO2 Cables With Edge Launch Connectors for High Temperature RF Measurements

F Alshatnawi, A Umar, E Enakerakpo… - 2024 IEEE 74th …, 2024 - ieeexplore.ieee.org
In the relentless pursuit of expanding the boundaries of what is achievable under extreme
temperature conditions, the precise measurement of RF signals becomes crucial. The ability …

Electromechanical and Thermal Characterization of Printed Liquid Metal Ink on Stretchable Substrate for Soft Robotics Multi-Sensing Applications

EM Abbara, M Alhendi, R Al-haidari… - 2023 IEEE 73rd …, 2023 - ieeexplore.ieee.org
Electronic skins (e-skins) are widely used in wearables, robotics, and medical field. In this
paper we introduce a fabrication and characterization of a bio-inspired robot electronic skin …