Significant factors affecting heat transfer performance of vapor chamber and strategies to promote it: A critical review

D Xie, Y Sun, G Wang, S Chen, G Ding - … Journal of Heat and Mass Transfer, 2021 - Elsevier
The increasing heat flux of electronic systems, caused by the miniaturization and high
integration, has posed a huge challenge to efficient and effective thermal management …

Advances of CNT-based systems in thermal management

W Yu, C Liu, S Fan - Nano Research, 2021 - Springer
Effective thermal management has become extremely urgent for electronics due to the
massive heat originated from the ever-rising power density. With the merits of high thermal …

Design of micropillar wicks for thin-film evaporation

S Adera, D Antao, R Raj, EN Wang - International Journal of Heat and Mass …, 2016 - Elsevier
The generation of concentrated heat loads in advanced microprocessors, GaN electronics,
and solar cells present significant thermal management challenges in defense, space and …

Heat transfer characteristic of an ultra-thin flat plate heat pipe with surface-functional wicks for cooling electronics

G Chen, Y Tang, Z Wan, G Zhong, H Tang… - … Communications in Heat …, 2019 - Elsevier
A novel ultra-thin aluminum flat plate heat pipe (UAFHP) with dimensions of 120× 120× 2
mm was developed for the thermal management of concentrated electronic equipment. An …

Thermal management of high-power LEDs based on integrated heat sink with vapor chamber

Y Tang, L Lin, S Zhang, J Zeng, K Tang, G Chen… - Energy conversion and …, 2017 - Elsevier
An integrated heat sink with vapor chamber (IHSVC) is developed in this study for the
thermal management of high-power light-emitting diodes (LEDs). The wick, as a key …

Experimental investigation on thermal performance of aluminum vapor chamber using micro-grooved wick with reentrant cavity array

J Zeng, S Zhang, G Chen, L Lin, Y Sun, L Chuai… - Applied Thermal …, 2018 - Elsevier
In order to provide efficient thermal management for high-power electronics while keeping
the light weight and compact physical size of the devices, a thin aluminum vapor chamber …

Recent advances in vapor chamber transport characterization for high-heat-flux applications

JA Weibel, SV Garimella - Advances in Heat Transfer, 2013 - Elsevier
Owing to their high reliability, simplicity of manufacture, passive operation, and effective heat
transport, flat heat pipes and vapor chambers are used extensively in the thermal …

Prediction and characterization of dry-out heat flux in micropillar wick structures

Y Zhu, DS Antao, Z Lu, S Somasundaram, T Zhang… - Langmuir, 2016 - ACS Publications
Thin-film evaporation in wick structures for cooling high-performance electronic devices is
attractive because it harnesses the latent heat of vaporization and does not require external …

Flow characterization in triply periodic minimal surface (TPMS)-based porous geometries: Part 1—Hydrodynamics

SS Rathore, B Mehta, P Kumar, M Asfer - Transport in Porous Media, 2023 - Springer
The modeling of flow and heat transfer in porous media systems has always been a
challenge, and the extended Darcy transport models are used for macro-level analysis …

Droplet evaporation on porous nanochannels for high heat flux dissipation

S Poudel, A Zou, SC Maroo - ACS applied materials & interfaces, 2020 - ACS Publications
Droplet wicking and evaporation in porous nanochannels is experimentally studied on a
heated surface at temperatures ranging from 35 to 90° C. The fabricated geometry consists …