Residual stress generation in grinding: Mechanism and modeling
Residual stress, a pivotal indicator for assessing surface quality, represents significant
thermomechanical stresses encountered during material removal processes. The precision …
thermomechanical stresses encountered during material removal processes. The precision …
Material removal mechanism and corresponding models in the grinding process: A critical review
Grinding is a key technology for difficult-to-machine materials, eg, super alloys, ceramics,
and composites. The material removal behavior is dependent on almost all grinding …
and composites. The material removal behavior is dependent on almost all grinding …
Surface integrity and material removal mechanisms in high-speed grinding of Al/SiCp metal matrix composites
S Guo, S Lu, B Zhang, CF Cheung - International Journal of Machine Tools …, 2022 - Elsevier
SiC particle reinforced Al metal matrix composites (Al/SiCp MMCs) are typical difficult-to-
machine materials due to the heterogeneous constituent. Poor surface integrity is commonly …
machine materials due to the heterogeneous constituent. Poor surface integrity is commonly …
Residual stress of grinding cemented carbide using MoS2 nano-lubricant
Z Zhang, M Sui, C Li, Z Zhou, B Liu, Y Chen… - … International Journal of …, 2022 - Springer
The special mechanical properties of cemented carbide with high strength and hardness will
cause complex stress due to excessive force and heat in the process of precision …
cause complex stress due to excessive force and heat in the process of precision …
Undeformed chip thickness with composite ultrasonic vibration-assisted face grinding of silicon carbide: Modeling, computation and analysis
Q Cheng, C Dai, Q Miao, Z Yin, J Chen, S Yang - Precision Engineering, 2024 - Elsevier
In order to achieve high efficiency and low damage processing of hard and brittle materials,
composite ultrasonic vibration-assisted face grinding (CUVAFG) has been proposed by …
composite ultrasonic vibration-assisted face grinding (CUVAFG) has been proposed by …
Material removal mechanism of SiC ceramics by elliptic ultrasonic vibration-assisted grinding (EUVAG) using single grain
K Zhang, Z Yin, C Dai, Q Miao, P Zhang, Z Cao - Ceramics International, 2023 - Elsevier
The variation laws of grinding force, grinding specific energy, material removal rate, scratch
morphology, and smooth surface ratio are investigated from the perspectives of wheel speed …
morphology, and smooth surface ratio are investigated from the perspectives of wheel speed …
Theoretical and experimental investigation into the formation mechanism of surface waviness in ultra-precision grinding
This paper studies the formation mechanism of surface waviness in ultra-precision grinding.
A dynamics model of the aerostatic bearing wheel spindle is developed to discuss its …
A dynamics model of the aerostatic bearing wheel spindle is developed to discuss its …
Cutting speed dependence of material removal mechanism for monocrystal silicon
H Tao, Y Liu, C Wang, D Zhao, X Lu - International Journal of Mechanical …, 2024 - Elsevier
In advanced semiconductor packaging, silicon wafers are typically thinned to tens of microns
in thickness using ultra-precision grinding techniques, and the cutting speed greatly …
in thickness using ultra-precision grinding techniques, and the cutting speed greatly …
Ceramizable phenolic adhesive modified by different inorganic particles: A comparative study of thermal stability, bonding strength and bonding mechanism
C Wang, J Ding, Z Huang, Y Zhuang, Y Li, M Shi… - Journal of the European …, 2023 - Elsevier
In this work, two ceramizable phenolic adhesives were prepared using ZrSi 2 particles or
ZrSi 2/B 4 C mix particles as the inorganic fillers. The thermal stability, bonding strength …
ZrSi 2/B 4 C mix particles as the inorganic fillers. The thermal stability, bonding strength …
Research on the bonding properties of vitrified bonds with porous diamonds and the grinding performance of porous diamond abrasive tools
J Li, W Fang, L Wan, X Liu, D Cao, K Han, Y Li… - Diamond and Related …, 2022 - Elsevier
Ordinary diamond presents the disadvantages of poor self-sharpening and concentrated
grinding stress when it is used as an abrasive. Moreover, this kind of diamond cannot be …
grinding stress when it is used as an abrasive. Moreover, this kind of diamond cannot be …