Residual stress, a pivotal indicator for assessing surface quality, represents significant
thermomechanical stresses encountered during material removal processes. The precision …

Grinding is a key technology for difficult-to-machine materials, eg, super alloys, ceramics,
and composites. The material removal behavior is dependent on almost all grinding …

SiC particle reinforced Al metal matrix composites (Al/SiCp MMCs) are typical difficult-to-
machine materials due to the heterogeneous constituent. Poor surface integrity is commonly …

The special mechanical properties of cemented carbide with high strength and hardness will
cause complex stress due to excessive force and heat in the process of precision …

In order to achieve high efficiency and low damage processing of hard and brittle materials,
composite ultrasonic vibration-assisted face grinding (CUVAFG) has been proposed by …

The variation laws of grinding force, grinding specific energy, material removal rate, scratch
morphology, and smooth surface ratio are investigated from the perspectives of wheel speed …

This paper studies the formation mechanism of surface waviness in ultra-precision grinding.
A dynamics model of the aerostatic bearing wheel spindle is developed to discuss its …

In advanced semiconductor packaging, silicon wafers are typically thinned to tens of microns
in thickness using ultra-precision grinding techniques, and the cutting speed greatly …

In this work, two ceramizable phenolic adhesives were prepared using ZrSi 2 particles or
ZrSi 2/B 4 C mix particles as the inorganic fillers. The thermal stability, bonding strength …

Ordinary diamond presents the disadvantages of poor self-sharpening and concentrated
grinding stress when it is used as an abrasive. Moreover, this kind of diamond cannot be …