A review of damage, void evolution, and fatigue life prediction models
Degradation, damage evolution, and fatigue models in the literature for various engineering
materials, mostly metals and composites, are reviewed. For empirical models established …
materials, mostly metals and composites, are reviewed. For empirical models established …
[图书][B] Mechanics of microelectronics
The technology trends of Microelectronics and Microsystems are mainly characterized by
miniaturization down to the nano-scale, increasing levels of system and function integration …
miniaturization down to the nano-scale, increasing levels of system and function integration …
Vibration reliability test and finite element analysis for flip chip solder joints
Vibration fatigue test and analysis methodology for flip chip solder joint fatigue life
assessment have been developed by performing vibration tests with constant G-level and …
assessment have been developed by performing vibration tests with constant G-level and …
Sn whisker growth during thermal cycling
K Suganuma, A Baated, KS Kim, K Hamasaki… - Acta materialia, 2011 - Elsevier
Pure Sn plating on ceramic chip capacitors was tested by thermal cycling both in air and in
vacuum for up to 3000 cycles and the whisker growth mechanism was clarified. A thin …
vacuum for up to 3000 cycles and the whisker growth mechanism was clarified. A thin …
Thermal Fatigue Failure of Micro-Solder Joints in Electronic Packaging Devices: A Review
L Li, X Du, J Chen, Y Wu - Materials, 2024 - mdpi.com
In electronic packaging products in the service process, the solder joints experience thermal
fatigue due to temperature cycles, which have a significant influence on the performance of …
fatigue due to temperature cycles, which have a significant influence on the performance of …
Low cycle fatigue life prediction using unified mechanics theory in Ti-6Al-4V alloys
N Bin Jamal M, A Kumar, C Lakshmana Rao… - Entropy, 2019 - mdpi.com
Fatigue in any material is a result of continuous irreversible degradation process.
Traditionally, fatigue life is predicted by extrapolating experimentally curve fitted empirical …
Traditionally, fatigue life is predicted by extrapolating experimentally curve fitted empirical …
Influence of power cycling test methodology on the applicability of the linear damage accumulation rule for the lifetime estimation in power devices
A Vaccaro, P Magnone - IEEE Transactions on Power …, 2023 - ieeexplore.ieee.org
The lifetime of power semiconductor devices, operating under a given mission profile and
subjected to power cycling stress, is conventionally estimated under the assumption of linear …
subjected to power cycling stress, is conventionally estimated under the assumption of linear …
Failure study of Sn37Pb PBGA solder joints using temperature cycling, random vibration and combined temperature cycling and random vibration tests
In this paper, the tin-lead (Sn-37wt% Pb) eutectic solder joints of plastic ball grid array
(PBGA) assemblies are tested using temperature cycling, random vibrations, and combined …
(PBGA) assemblies are tested using temperature cycling, random vibrations, and combined …
PBGA packaging reliability assessments under random vibrations for space applications
YK Kim, DS Hwang - Microelectronics Reliability, 2015 - Elsevier
In this study, experimental and numerical analyses on the solder joint reliability of plastic ball
grid array under harsh random vibration and thermal loadings were presented. The chips …
grid array under harsh random vibration and thermal loadings were presented. The chips …
Vibration lifetime estimation of PBGA solder joints using Steinberg model
The work studies the vibration lifetime modeling of Sn37Pb soldered plastic ball grid array
(PBGA) assemblies on the basis of vibration tests, finite element analysis (FEA) and …
(PBGA) assemblies on the basis of vibration tests, finite element analysis (FEA) and …