Antenna-in-package (AiP) technology, in which there is an antenna (or antennas) with a
transceiver die (or dies) in a standard surface-mounted device, represents an important …

This tutorial presents an overview of the technological advances in millimeter-wave (mm-
wave) circuit components, antennas, and propagation that will soon allow 60-GHz …

This work presents a highly integrated 57-64 GHz 4-channel receiver 2-channel transmitter
chip targeting short range sensing and large bandwidth communications. The chip is …

A fully-integrated 16-element 60-GHz phased-array receiver is implemented in IBM 0.12-μm
SiGe BiCMOS technology. The receiver employs RF-path phase-shifting and is designed for …

Industry 4.0 is a new paradigm of digitalization and automation that demands high data rates
and real-time ultra-reliable agile communication. Industrial communication at sub-6 GHz …

This paper presents for the first time a 60-GHz receiving switched-beam antenna on organic
liquid crystal polymer (LCP) platform. A 4× 1 quasi-Yagi array is incorporated with a 4× 4 …

The high cost of high-resolution phase shifters required to maintain precise control over the
array beam pattern in traditional phased arrays preclude their use in a variety of emerging …

A packaging solution for the integration of an MMIC and a thin film antenna into a single
surface-mountable package is presented. It is based on an air cavity in the package base …

This article summarizes the development of mature and highly integrated SiGe BiCMOS ICs
for gigabit-per-second communications according to the requirements of the IEEE 802.15. 3c …

This paper presents an antenna-in-package (AiP) solution with embedded wafer Level ball
grid array (eWLB) packaging technology. The primary antenna is realized in the …