Technological advancements in various electronic devices, consumer or industrial power
electronics, as well as higher demand for energy efficiency, have in recent years presented …

Boiling is a multiscale phenomenon. Nucleation and rapid bubble growth at the heated wall
provide a highly localized mechanism for heat transfer to the surrounding liquid. The liquid …

The low boiling temperature of dielectric fluids makes them suitable for satisfying the cooling
requirements of advanced high-energy-density devices commonly found in microelectronics …

Surface engineering aimed at tuning the wettability and morphology of the boiling surface is
a facile approach to moderate and enhance the nucleate boiling process. Key issues …

The enhancement of boiling heat transfer has been extensively shown to be achievable
through surface texturing or fluid property modification, yet few studies have investigated the …

The pool boiling characteristics on the enhanced surfaces with sintered copper powder
coatings with and without nano-treatment were experimentally investigated. Three kinds of …

The significance of structured surfaces for energy conservation in two-phase heat transfer
applications is well-recognized within the scientific community. Introducing advanced non …

Enhancing boiling heat transfer by changing the working fluid or surface modification is an
effective and simple method. In order to investigate the effect of the coupling characteristics …

Increased cooling requirements of many compact systems involving high heat fluxes
demand the development of high-performance cooling techniques including immersion …

Pool boiling represents a potentially efficient mechanism for thermal management of power
electronic components. The present study investigates pool boiling heat transfer using …