Printed circuit board defect detection methods based on image processing, machine learning and deep learning: A survey

Q Ling, NAM Isa - IEEE Access, 2023 - ieeexplore.ieee.org
Printed circuit boards (PCBs) are a nearly ubiquitous component of every kind of electronic
device. With the rapid development of integrated circuit and semiconductor technology, the …

[PDF][PDF] 基于机器视觉的PCB 缺陷检测算法研究现状及展望

吴一全, 赵朗月, 苑玉彬, 杨洁 - 仪器仪表学报, 2022 - emt.cnjournals.com
印刷电路板(PCB) 是电子零件的基板, 需求量极大, 承载着电路元件和导线的布局,
其优良与否对电子产品的质量有着重要影响. 由于电子产品的制作逐渐趋于轻薄, 精小 …

SMT solder joint inspection via a novel cascaded convolutional neural network

N Cai, G Cen, J Wu, F Li, H Wang… - IEEE Transactions on …, 2018 - ieeexplore.ieee.org
Due to the excellent self-learning ability of deep learning, we propose a novel deep-learning-
based method to inspect surface-mount technology (SMT) solder joints in this paper. In …

Solder joint inspection on printed circuit boards: A survey and a dataset

F Ulger, SE Yuksel, A Yilmaz… - IEEE Transactions on …, 2023 - ieeexplore.ieee.org
Surface mount technology (SMT) is a procedure for mounting electronic components to the
surface of printed circuit boards (PCBs). Although the SMT procedure is more reliable than …

A new IC solder joint inspection method for an automatic optical inspection system based on an improved visual background extraction algorithm

N Cai, J Lin, Q Ye, H Wang, S Weng… - IEEE Transactions on …, 2015 - ieeexplore.ieee.org
In the field of automatic optical inspection (AOI), defect recognition for an integrated circuit
(IC) solder joint is a long-standing task. Inspired by a visual background extraction (ViBe) …

A survey of detection methods for die attachment and wire bonding defects in integrated circuit manufacturing

L Alam, N Kehtarnavaz - IEEE Access, 2022 - ieeexplore.ieee.org
Defect detection plays a vital role in the manufacturing process of integrated circuits (ICs).
Die attachment and wire bonding are two steps of the manufacturing process that determine …

IC solder joint inspection via robust principle component analysis

N Cai, Y Zhou, Q Ye, G Liu, H Wang… - IEEE Transactions on …, 2017 - ieeexplore.ieee.org
Defect inspection of integrated circuits (ICs) solder joints is a long-standing task. This paper
proposes a novel IC solder joint inspection method based on the idea of robust principle …

Feature-extraction-based inspection algorithm for IC solder joints

F Wu, X Zhang - IEEE Transactions on components, packaging …, 2011 - ieeexplore.ieee.org
In order to inspect solder joint defects of integrated circuit (IC) components on printed circuit
boards (PCBs), an automatic optical inspection (AOI) algorithm is developed. Firstly …

A review of SMD-PCB defects and detection algorithms

AFM Hani, AS Malik, R Kamil… - … Conference on Machine …, 2012 - spiedigitallibrary.org
Detection and classification of defects on surface mount device printed circuit board (SMD-
PCB) is an important requirement in electronic manufacturing process. This process which is …

IC solder joint inspection based on an adaptive-template method

Q Ye, N Cai, J Li, F Li, H Wang… - IEEE Transactions on …, 2018 - ieeexplore.ieee.org
In this paper, an integrated circuit (IC) solder joint inspection algorithm is proposed based on
an adaptive-template method. To the best of our knowledge, it is the first time to utilize the …