Printed circuit board defect detection methods based on image processing, machine learning and deep learning: A survey
Q Ling, NAM Isa - IEEE Access, 2023 - ieeexplore.ieee.org
Printed circuit boards (PCBs) are a nearly ubiquitous component of every kind of electronic
device. With the rapid development of integrated circuit and semiconductor technology, the …
device. With the rapid development of integrated circuit and semiconductor technology, the …
[PDF][PDF] 基于机器视觉的PCB 缺陷检测算法研究现状及展望
吴一全, 赵朗月, 苑玉彬, 杨洁 - 仪器仪表学报, 2022 - emt.cnjournals.com
印刷电路板(PCB) 是电子零件的基板, 需求量极大, 承载着电路元件和导线的布局,
其优良与否对电子产品的质量有着重要影响. 由于电子产品的制作逐渐趋于轻薄, 精小 …
其优良与否对电子产品的质量有着重要影响. 由于电子产品的制作逐渐趋于轻薄, 精小 …
SMT solder joint inspection via a novel cascaded convolutional neural network
N Cai, G Cen, J Wu, F Li, H Wang… - IEEE Transactions on …, 2018 - ieeexplore.ieee.org
Due to the excellent self-learning ability of deep learning, we propose a novel deep-learning-
based method to inspect surface-mount technology (SMT) solder joints in this paper. In …
based method to inspect surface-mount technology (SMT) solder joints in this paper. In …
Solder joint inspection on printed circuit boards: A survey and a dataset
Surface mount technology (SMT) is a procedure for mounting electronic components to the
surface of printed circuit boards (PCBs). Although the SMT procedure is more reliable than …
surface of printed circuit boards (PCBs). Although the SMT procedure is more reliable than …
A new IC solder joint inspection method for an automatic optical inspection system based on an improved visual background extraction algorithm
In the field of automatic optical inspection (AOI), defect recognition for an integrated circuit
(IC) solder joint is a long-standing task. Inspired by a visual background extraction (ViBe) …
(IC) solder joint is a long-standing task. Inspired by a visual background extraction (ViBe) …
A survey of detection methods for die attachment and wire bonding defects in integrated circuit manufacturing
L Alam, N Kehtarnavaz - IEEE Access, 2022 - ieeexplore.ieee.org
Defect detection plays a vital role in the manufacturing process of integrated circuits (ICs).
Die attachment and wire bonding are two steps of the manufacturing process that determine …
Die attachment and wire bonding are two steps of the manufacturing process that determine …
IC solder joint inspection via robust principle component analysis
Defect inspection of integrated circuits (ICs) solder joints is a long-standing task. This paper
proposes a novel IC solder joint inspection method based on the idea of robust principle …
proposes a novel IC solder joint inspection method based on the idea of robust principle …
Feature-extraction-based inspection algorithm for IC solder joints
F Wu, X Zhang - IEEE Transactions on components, packaging …, 2011 - ieeexplore.ieee.org
In order to inspect solder joint defects of integrated circuit (IC) components on printed circuit
boards (PCBs), an automatic optical inspection (AOI) algorithm is developed. Firstly …
boards (PCBs), an automatic optical inspection (AOI) algorithm is developed. Firstly …
A review of SMD-PCB defects and detection algorithms
Detection and classification of defects on surface mount device printed circuit board (SMD-
PCB) is an important requirement in electronic manufacturing process. This process which is …
PCB) is an important requirement in electronic manufacturing process. This process which is …
IC solder joint inspection based on an adaptive-template method
In this paper, an integrated circuit (IC) solder joint inspection algorithm is proposed based on
an adaptive-template method. To the best of our knowledge, it is the first time to utilize the …
an adaptive-template method. To the best of our knowledge, it is the first time to utilize the …