Enabling chip, package and PCB system co design and analysis in a heterogeneous integration...

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3D 异构集成的多层级协同仿真

曾燕萍， 张景辉， 朱旻琦， 顾林 - 电子与封装, 2021 - ep.org.cn
3D 异构集成技术是未来电子行业的关键技术, 促使电子系统朝着高性能, 低延迟, 小尺寸,
轻质量, 低功耗和低成本的方向发展. 然而, 随着信号传输速率和带宽的提高 …
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Optimizing Concurrent Co-Designing of ICs and Package using Multi Technology and RF Solution

N Agrawal, A Kumar, H Marwah - 2024 28th International …, 2024 - ieeexplore.ieee.org
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Development of a Step Down DC-DC Converter for Power Grid Energy Harvesting

JMF Gomes - 2021 - search.proquest.com
Development of a Step Down DC-DC Converter for Power Grid Energy Harvesting Page 1 João
Mário Fernandes Gomes Licenciatura em Engenharia Electrotécnica e Computadores …
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