Review of Die-Attach Materials for SiC HighTemperature Packaging

F Hou, Z Sun, M Su, J Fan, X You, J Li… - … on Power Electronics, 2024 - ieeexplore.ieee.org
Silicon carbide (SiC) devices have shown definite advantages over Si counterparts in high-
temperature, high-voltage, and high-frequency applications. To fully exploit the potentiality of …

Atomistic study of shearing mechanism of nano-Ag joints and processing parameter optimization

H Li, Z Qi, G Yang, L Ding, K Li, F Wu, H Huang - Applied Surface Science, 2025 - Elsevier
The wide band gap semiconductors (WBGs), such as silicon carbide (SiC) and gallium
nitride (GaN), have been widely applied in high-performance electronics due to their ability …

Shape Synergy of Ag@ Cu Chip Packaging Nano‐Paste and Its Sintering Reliability

C Yin, W Guo, W Zhao, C Zhang, Z Peng… - Advanced Engineering … - Wiley Online Library
Electrochemical migration of Ag can result in failure of power chips, thus affecting the
application of nano‐Ag paste as packaging material. In this study, a novel sintered material …

Exploring an Alternative Technology for Manufacturing Electronics for Extreme Temperatures

MR Patel - 2023 - search.proquest.com
Within our increasingly digital world, there is a demand to integrate electronics into every
industry to take advantage of applications in communication, optimization, and artificial …