A 30-Year Review on Nanocomposites: Comprehensive Bibliometric Insights into Microstructural, Electrical, and Mechanical Properties Assisted by Artificial …

F Gomes Souza Jr, S Bhansali, K Pal… - Materials, 2024 - mdpi.com
From 1990 to 2024, this study presents a groundbreaking bibliometric and sentiment
analysis of nanocomposite literature, distinguishing itself from existing reviews through its …

Unveiling yield strength of metallic materials using physics-enhanced machine learning under diverse experimental conditions

JA Lee, RB Figueiredo, H Park, JH Kim, HS Kim - Acta Materialia, 2024 - Elsevier
In the materials science domain, the accurate prediction of the yield strength of metallic
compositions has often resulted in extensive experimental endeavors, leading to …

Effects of heat treatment parameters and grain sizes on mechanical response of amorphous/crystalline CuZr composites

M Yin, M Duan, T Fu, J Wang, S Weng, X Chen… - Mechanics of …, 2024 - Elsevier
The amorphous phase proportion in nanocrystalline/amorphous CuZr samples was tailored
using heat treatment processes under a fast-dynamic regime by varying temperature and …

Influence of synchronized pulse bias on the Microstructure and Properties of CrSiN nano-composite ceramic films deposited by MIS-HiPIMS

B Gui, H Hu, H Zhou, T Zhang, X Liu, Z Ma, C Xian - Ceramics International, 2024 - Elsevier
In this study, CrSiN nano-composite ceramic films with optimized structure were prepared at
low temperature using MIS-HiPIMS technique, owing to improved utilization of the high …

Advancements in Nanocomposites: An In-Depth Exploration of Microstructural, Electrical, and Mechanical Dynamics

FG Souza Jr, S Bhansali, K Pal, F da Silveira Maranhão… - 2024 - preprints.org
This research presents a comprehensive bibliometric and sentiment analysis of
nanocomposite literature from 1990 to 2024. Employing cutting-edge computational …

Connection Reinforcement Design of W-Cu Joint: Transforming Immiscible Interface into Dual Reaction Diffusion Interface

D Xu, P Chen, K Fu, C Sang, R Chen, T Hong… - Available at SSRN … - papers.ssrn.com
Weakly chemical bonding between dissimilar metals such as tungsten (W) and copper (Cu)
due to the metallurgical incompatibility severely restricts the achievement of high strength. In …