A review of self-heating effects in advanced CMOS technologies

C Prasad - IEEE Transactions on Electron Devices, 2019 - ieeexplore.ieee.org
The march toward dimensional scaling and higher performance has led the semiconductor
industry to consider nonplanar topologies and different material systems. These choices …

A device-to-system perspective regarding self-heating enhanced hot carrier degradation in modern field-effect transistors: A topical review

MA Alam, BK Mahajan, YP Chen, W Ahn… - … on Electron Devices, 2019 - ieeexplore.ieee.org
As foreseen by Keyes in the late 1960s, the self-heating effect has emerged as an important
concern for device performance, output power density, run-time variability, and reliability of …

Improvement in self-heating characteristic by incorporating hetero-gate-dielectric in gate-all-around MOSFETs

YS Song, JH Kim, G Kim, HM Kim… - IEEE Journal of the …, 2020 - ieeexplore.ieee.org
For improving self-heating effects (SHEs) in gate-all-around metal-oxide-semiconductor field-
effect transistors (GAA MOSFETs), hetero-gate-dielectric (HGD) is utilized. The HGD consists …

Physical insights into vacancy-based memtransistors: toward power efficiency, reliable operation, and scalability

M Sivan, JF Leong, J Ghosh, B Tang, J Pan… - ACS …, 2022 - ACS Publications
Memtransistors that combine the properties of transistor and memristor hold significant
promise for in-memory computing. While superior data storage capability is achieved in …

Self-heating in advanced CMOS technologies

C Prasad, S Ramey, L Jiang - 2017 IEEE International …, 2017 - ieeexplore.ieee.org
On advanced technology nodes, increases in power density, non-planar architectures and
different material systems can exacerbate local self-heating due to active power dissipation …

On the trap locations in bulk FinFETs after hot carrier degradation (HCD)

Z Yu, Z Zhang, Z Sun, R Wang… - IEEE Transactions on …, 2020 - ieeexplore.ieee.org
In this brief, typical locations of the interface and oxide traps generated by the hot carrier
degradation (HCD) in FinFETs are studied with experiments and “atomistic” TCAD …

Integrated modeling of self-heating of confined geometry (FinFET, NWFET, and NSHFET) transistors and its implications for the reliability of sub-20 nm modern …

W Ahn, SH Shin, C Jiang, H Jiang, MA Wahab… - Microelectronics …, 2018 - Elsevier
The evolution of transistor topology from planar to confined geometry transistors (ie, FinFET,
Nanowire FET, Nanosheet FET) has met the desired performance specification of sub-20 nm …

Hot carrier degradation-induced dynamic variability in FinFETs: Experiments and modeling

Z Yu, Z Sun, R Wang, J Zhang… - IEEE Transactions on …, 2020 - ieeexplore.ieee.org
In this article, the dynamic variability induced by hot carrier degradation (HCD) in FinFETs is
studied with decomposing the variation contributions of multiple types of traps. The …

Reliability assessment of 3nm GAA logic technology featuring multi-bridge-channel FETs

S Kim, H Park, E Choi, YH Kim, D Kim… - 2023 IEEE …, 2023 - ieeexplore.ieee.org
In this paper, we report reliability assessment of the Multi-Bridge-Channel FET (MBCFET)
adopted 3nm gate all around (GAA) logic technology in comparison with the 4 and 8nm …

Investigation of trap density effect in gate-all-around field effect transistors using the finite element method

M Belkhiria, F Aouaini, S A. Aldaghfag, F Echouchene… - Electronics, 2023 - mdpi.com
Trap density refers to the density of electronic trap states within dielectric materials that can
capture and release charge carriers (electrons or holes) in a semiconductor channel …