Wide band gap (WBG) semiconductors require packaging with reduced parasitic inductance
and capacitance. To achieve this, new packaging solutions are proposed that increase …

Power electronic systems employing wide-bandgap GaN transistors promise high efficiency
operation and power density but require minimized parasitic circuit elements and an …

Digital design has been successfully employed in development of new compact wide
bandgap power modules, achieving unprecedented switching speeds while maintaining low …

Companies working on semiconductors must currently assure the customers of not only the
performance of the semiconductor device per se, but also its performance when it is …

Thermal simulations evaluated temperature distribution of 10kV and 15kV SiC-MOSFETs
with larger die edge areas. Experimental temperature measurements of the die surface …

Due to its electrical conductivity and fluidity, liquid metal interconnection has the potential to
become a new industrial power semiconductors packaging application method to solve the …

Industrial heating plays a significant role in the modern society. It constitutes about 20% of
the global energy consumption. Modern industrial heating plants (especially induction and …

This paper presents an Improved Bidirectional Hybrid Switched Capacitor DC-DC Converter
(I-BHSC). By using switched inductive or capacitive cells, hybrid converters achieve better …

Determining the reliability of 10 kV SiC-MOSFET power modules experimentally, is
challenging due to the low number of samples available in the market. A digital design …

A high power density is required in wide band gap power semiconductor packaging, which
has led to the popularity of sintered nanosilver as an interconnecting material. However …