Bulk-Acoustic Wave (BAW) resonators and filters are highly integrated devices, which
represent an effective alternative for narrow-band components (up to 5% fractional …

This paper presents a novel approach to construct a multiple-input multiple-output (MIMO)
antenna in a small package based on integrated passive device (IPD) manufacturing …

This paper presents the design of a packaged antenna including glass substrate. A square
patch antenna is implemented on glass substrate exploiting IPD™ technology, and excited …

This paper presents a 2.45-GHz complementary metal–oxide–semiconductor (CMOS) ultra-
low-power transmitter suitable for cochlear implant application. This system will be energy …

A new dielectric resonator antenna (DRA) solution for the complete integration of radio front
end at 60GHz is presented. The solution is a SoC configuration consisting of an integrated …

We discuss in this paper about the recent development of Antennas on Chip (AoC),
especially in the context of emerging applications in the millimetre wave frequency range …

An antenna miniaturization technique that can substantially miniaturize an antenna to allow
its incorporation into a compact package for WLAN (2.4-2.484 GHz) applications is …

In this paper, we present a high efficiency antenna for 60 GHz low-cost packaged modules.
This antenna is fabricated using IPD™ technology which is flip-chipped on a PCB …

As a result of their myriad of advantages over silicon and other conventional substrate
technologies, glass substrates have received significant attention from the electronic …

This paper presents for the first time a hybrid silicon-organic packaged mm-wave antenna,
that is flip-chip bonded to a 400 µm thick silicon substrate through gold bumps and a non …