Characterization of a nonlinear resistive polymer-nanoparticle composite coating for electric field reduction in a medium-voltage power module

Z Zhang, KDT Ngo, GQ Lu - IEEE Transactions on Power …, 2021 - ieeexplore.ieee.org
Medium-voltage (MV) silicon carbide power devices are emerging and have the potential to
serve in various power grid applications. However, the high blocking voltage and reduced …

Packaging of a 10-kV double-side cooled silicon carbide diode module with thin substrates coated by a nonlinear resistive polymer-nanoparticle composite

Z Zhang, S Lu, B Wang, Y Zhang, N Yun… - … on Power Electronics, 2022 - ieeexplore.ieee.org
Medium-voltage silicon carbide (SiC) power modules are a critical component in grid-bound
power conversion systems, and the packaging of these modules dictates the performance …

Chip size minimization for wide and ultrawide bandgap power devices

B Wang, M Xiao, Z Zhang, Y Wang… - … on Electron Devices, 2023 - ieeexplore.ieee.org
Chip size () optimization is key to the accurate analysis of device and material costs and the
design of multichip modules. It is particularly critical for wide bandgap (WBG) and ultrawide …

Packaging of a 15-kV silicon carbide MOSFET with insulation enhanced by a nonlinear resistive polymer-nanoparticle coating

Z Zhang, S Lu, C Nicholas, N Yun… - 2022 IEEE Energy …, 2022 - ieeexplore.ieee.org
Packaging of medium-voltage power semiconductor devices is challenging because the
insulation materials are demanded to withstand extremely high electric-field stresses as well …

Effective Field Grading at 200o C for MediumVoltage Power Modules of a Nonlinear Resistive Polymer Nanocomposite Coating

Z Zhang, Q Yuchi, C Nicholas… - IEEE Transactions on …, 2024 - ieeexplore.ieee.org
Medium-voltage silicon carbide power modules have the potential to enable a more
renewable, resilient, and reliable electric grid. However, their electrical insulation, especially …

Package Design and Analysis of a 20-kV Double-Sided Silicon Carbide Diode Module With Polymer Nanocomposite Field-Grading Coating

Z Zhang, E Arriola, C Nicholas, J Lynch… - IEEE Transactions …, 2024 - ieeexplore.ieee.org
To tackle the insulation challenges present in packaging medium-voltage (MV) silicon
carbide (SiC) power devices, we developed a package design for a 20-kV SiC. This design …

Forced Fluorinated Liquid Cooling for Medium Voltage SiC Power Modules: Concurrently Addressing Electrical and Thermal Challenges

L Wang, H Zheng, Y Wang, J Gong… - … on Power Electronics, 2024 - ieeexplore.ieee.org
Enhanced insulation and superior thermal characteristics are crucial in advanced packaging
for medium voltage (MV) silicon carbide (SiC) power modules. Nonetheless, the reduction in …

Field-Grading Effect of a Nonlinear Resistive Polymer-Nanoparticle Composite Triple-Point Coating on Direct-Bond Copper Substrates for Packaging Medium-Voltage …

Z Zhang, Q Yuchi, F Boshkovski… - 2022 IEEE Electrical …, 2022 - ieeexplore.ieee.org
Triple points on direct-bond copper substrates for packaging medium-voltage power
modules are locations of high electric-field stress responsible for partial discharge in the …

Insulation Capability at 10 kV,> 300 V/ns of a Nonlinear Resistive Polymer Nanocomposite Field-Grading Coating in a 15-kV Silicon Carbide Module

Z Zhang, P Fu, J Lynch, S Lu, C Nicholas… - … on Power Electronics, 2024 - ieeexplore.ieee.org
Emerging medium-voltage silicon carbide devices offer the potential to achieve more
efficient and compact power electronics for grid-tied applications. However, the lack of an …

Impacts of the Bottom Copper Layer of Direct-Bond Copper Substrates on the Partial Discharge Performance in Power Modules

Y Gao, K Yin, CL Bak, AB Jørgensen… - … on Power Electronics, 2024 - ieeexplore.ieee.org
This paper studies the impacts of the bottom copper layer of direct-bond copper (DBC)
substrates on the partial discharge (PD) performance of the power modules. Finite element …