Recent progress of nano-technology with near-field scanning optical microscope (NSOM) is
surveyed in this article. We focus mainly on NSOM, nano-scale spectroscopy with NSOM …

Since the carrier mobility in a strained silicon thin layer is enhanced compared to unstrained
layers, strained silicon is finding tremendous attention as a promising material for ultralarge …

This book outlines physically intuitive concepts and theories for students, engineers, and
scientists who will be engaged in research in nanophotonics and atom photonics. The main …

This paper presents the design and fabrication of batch-processed cantilever probes with
electrical shielding for scanning microwave impedance microscopy. The diameter of the tip …

A reproducible wafer‐scale method to obtain 3D nanostructures is investigated. This
method, called corner lithography, explores the conformal deposition and the subsequent …

Thermal oxidation at low temperatures (below 1050° C) is widely used in the
microfabrication of sharp silicon tips. However, the influences of the oxidation temperature …

Sensors Update ensures that you stay at the cutting edge of the field. Built upon the series
Sensors, it presents an overview of highlights in the field. Coverage includes current …

In this work, new novel methods for fabricating a thermal probe array with 32/spl times/32
probes on one chip are proposed. It consists of silicon micromachined probe, AlN actuator …

Direct wafer bonding is a method for fabricating advanced substrates for
microelectromechanical systems (MEMS) and integrated circuits (IC). The most typical …

This article presents a simple measurement setup for characterization of a combined near-
field scanning optical and atomic force microscopy (NSOM/AFM) using an aperture Si based …