The introduction of wide-band semiconductor devices has led to the development of
electronic components with a high degree of integration and power density. The use of …

Nanotechnology is gradually applied to the preparation of heat dissipation materials with the
miniaturization of electronic devices. Electrospinning technology has received extensive …

Thermally conductive films are essential interface materials placed between a heat source
and a heat sink to address the heat dissipation issue, especially for electronic devices …

For effective heat dissipation in portable electronics, there is a great demand for lightweight
and flexible films with superior thermal transport properties. Despite extensive efforts …

Depositing carbon films rich in the diamond phase was carried out in many studies.
However, characterization of the deposited carbon films does not reveal up-to-date …

Epoxy (EP) is the preferred packaging materials used as a crucial component in power
semiconductor devices. However, its low thermal conductivity (TC) always has negative …

Spherical artificial graphite (SAG) has the potential to enhance the thermal conductivity of
polymer-based composites. However, the poor compatibility and weak interaction between …

To deal with the heat dissipation problem produced by a high integrated circuit, the
preparation of heat spreaders with excellent heat transportation performance is increasing in …

This chapter focuses on the fire retardancy features of polymeric materials involving
fullerene and nanodiamond (ND). It starts by presenting the integration of carbon-based …

SiC nanowires (SiCNWs) are promising fillers due to their high thermal conductivity,
chemical stability, and mechanical strength. Currently, the reported methods are generally …