Laser‐assisted bonding (LAB) is an advanced technology in which a homogenized laser
beam is selectively applied to a chip. Previous researches have demonstrated the feasibility …

A simultaneous transfer and bonding (SITRAB) process using areal laser irradiation is
introduced for high‐yield and cost‐effective production of mini‐or micro‐light‐emitting diode …

The transfer process of moving individual micro-LED chips to a display substrate has been
regarded as the biggest technical obstacle for the commercialization of displays based on …

TSV chips were designed and fabricated to investigate the effects of the types of the stacking
process on the manufacturability. Two processes were compared: thermocompression and …

Thermoset resins have been extensively utilized as an adhesive for electronic devices. In
particular, semiconductor packaging materials between chips/substrates require electrical …

An epoxy-based solder paste (ESP) is a promising alternative to conventional solder pastes
to improve the reliability of fine-pitch electrical joining because the epoxy encapsulates the …

A novel, maskless, low‐volume bumping material, called solder bump maker, which is
composed of a resin and low‐melting‐point solder powder, has been developed. The resin …

Epoxy resins with acidic compounds feature adhesion, robustness, and deoxidizing ability.
In this study, hybrid adhesive films with deoxidizing and curing capabilities for …

Flexible displays and electronics are emerging technology. A PET substrate is one the
strong candidate substrate materials for the applications, however, its low thermal stability …

Abstract Laser-Assisted Bonding (LAB) and its bonding materials help to find solutions to
productivity, reduced warpage during fabricating modules, and fine-pitch bonding. Fluxing …