Morphological and mechanical behaviour of Cu–Sn alloys—a review
M Karthik, J Abhinav, KV Shankar - Metals and Materials International, 2021 - Springer
The current paper reviews the research conducted on wrought Cu–Sn, Cu–Sn–Ti and Cu–
Sn–Zn alloys intending to reveal the details on morphological and mechanical behaviour …
Sn–Zn alloys intending to reveal the details on morphological and mechanical behaviour …
[HTML][HTML] Nucleation and growth of Ag3Sn in Sn-Ag and Sn-Ag-Cu solder alloys
Abstract Large Ag 3 Sn plates in solder joints can affect the reliability of electronics,
however, the factors affecting their nucleation and morphology are not well understood …
however, the factors affecting their nucleation and morphology are not well understood …
Advances in Focused Ion Beam Tomography for Three-Dimensional Characterization in Materials Science
Over the years, FIB-SEM tomography has become an extremely important technique for the
three-dimensional reconstruction of microscopic structures with nanometric resolution. This …
three-dimensional reconstruction of microscopic structures with nanometric resolution. This …
Inducing low-temperature melting of TiNiCuNb eutectic alloy for manufacturing strong C/C-SiC composite joints
This work designed a novel TiNiCuNb eutectic alloy for manufacturing C/C-SiC composite
joints. By introducing Ti into the semi-solid TiNiCuNb alloy, low-temperature melting of this …
joints. By introducing Ti into the semi-solid TiNiCuNb alloy, low-temperature melting of this …
Nucleation and growth of Cu6Sn5 during the aging process of Cu/Sn interface in electronic packaging-by in-situ TEM
J Wang, Z Lv, L Zhang, F Duan, J Wang, F Li, H Chen… - Acta Materialia, 2024 - Elsevier
The rapid nucleation of Cu 6 Sn 5 during the soldering process, as well as its growth at the
solid-state interface system (Cu/Sn) during chip service, present significant challenges. To …
solid-state interface system (Cu/Sn) during chip service, present significant challenges. To …
Heterogeneous microstructure and mechanical behaviour of Al-8.3 Fe-1.3 V-1.8 Si alloy produced by laser powder bed fusion
The relationship between processing parameters, microstructure, and mechanical properties
of Al-8.3 Fe-1.3 V-1.8 Si alloy processed by laser powder bed fusion is seldom studied …
of Al-8.3 Fe-1.3 V-1.8 Si alloy processed by laser powder bed fusion is seldom studied …
[HTML][HTML] The effect of Bi on the microstructure, electrical, wettability and mechanical properties of Sn-0.7 Cu-0.05 Ni alloys for high strength soldering
This paper elucidated the effects of the Bi element (0 wt%, 0.5 wt% and 1.5 wt%) on the
microstructure, electrical, wettability and mechanical properties of the Sn-0.7 Cu-0.05 Ni as a …
microstructure, electrical, wettability and mechanical properties of the Sn-0.7 Cu-0.05 Ni as a …
The role of intermetallic compounds in controlling the microstructural, physical and mechanical properties of Cu-[Sn-Ag-Cu-Bi]-Cu solder joints
R Sayyadi, H Naffakh-Moosavy - Scientific reports, 2019 - nature.com
Abstract A lead-free Sn-2.5 Ag-0.7 Cu base solder with different weight percentages of
bismuth (0, 1, 2.5, 5) was used. Thermal properties, microstructure, wettability and …
bismuth (0, 1, 2.5, 5) was used. Thermal properties, microstructure, wettability and …
Anisotropic thermal expansion of Ni3Sn4, Ag3Sn, Cu3Sn, Cu6Sn5 and βSn
The directional coefficient of thermal expansion (CTE) of intermetallics in electronic
interconnections is a key thermophysical property that is required for microstructure-level …
interconnections is a key thermophysical property that is required for microstructure-level …
[HTML][HTML] Revealing growth mechanisms of faceted Al2Cu intermetallic compounds via high-speed Synchrotron X-ray tomography
This study used high-speed synchrotron X-ray tomography to image the growth of Al 2 Cu
intermetallic compounds in 4D (3D plus time) during solidification of Al-45wt% Cu alloy. Two …
intermetallic compounds in 4D (3D plus time) during solidification of Al-45wt% Cu alloy. Two …