The special mechanical properties of nanoparticles allow for novel applications in many
fields, eg, surface engineering, tribology and nanomanufacturing/nanofabrication. In this …

A number of acoustic and fluid-dynamic phenomena appear in ultrasonic cleaning baths
and contribute to physical cleaning of immersed surfaces. Propagation and repeated …

As semiconductor integrated circuits (SICs) have been developed to scale down to obtain
higher integration and better performance, more chemical mechanical polishing (CMP) …

It has been very difficult to remove smaller ceria particles from silicon dioxide surfaces. One
of the likely reasons is that the smaller ceria particles with a higher surface concentration of …

Physical cleaning techniques are of great concern to remove particulate contamination
because of their low environmental impact. One of the promising candidates is based on …

As the technology node moves below 10 nm, cobalt with its low resistivity, superior adhesion
property, and wettability with copper, promises to change the conductor landscape in many …

A previously developed aqueous cleaning solution (4.2 mol l− 1 each of H 2 O 2 and NH 4
OH) was found to be ineffective in cleaning oxide/nitride surfaces after contamination with …

Scaling of gate lengths has led to significant improvement in semiconductor device
performance. However, fabrication complexities have also increased and surface defects …

Aero-engine fouling will affect the economy and safety of aircraft, and online washing is the
main method to solve the problem of aero-engine fouling. Online washing is considered to …

The mechanical effect of colloidal silica concentration in copper chemical mechanical
planarization (CMP) is considered in this paper by using friction force monitoring system …