During the past decades, series of lead-free solders have been developed rapidly, and are
considered as the attractive interconnection materials replacing traditional Sn-Pb solders in …

The quantity and variety of parameters involved in the failure evolutions in solder joints
under a thermo-mechanical process directs the reliability assessment of electronic devices …

Light emitting diodes (LEDs) as the emerging green light sources are of great significance to
achieve the energy saving and emission reduction. The encapsulation materials as the key …

It has often been observed that the agglomeration and floating of graphene during soldering
graphene nanosheets-reinforced Sn–Ag–Cu (GNSs/SAC) alloys, which considerably …

Aiming for a suitable die-attached substrate for Ag-sintered joint technology during harsh
operating environment, three surface finishes of sputtered Ti/Ag-layers, electroless Ni-/Pt-/Ag …

Background: In recent years, electronic textiles (e-textiles) have attracted widespread
attention due to their versatility, but still lack a good packaging technique. Soldering, one of …

One of the crucial factors in evaluating the reliability of an electronic appliance is fatigue
failure of the interconnecting solder joints. In most situations, large bulk samples are used to …

Aiming to solve the intrinsic brittleness of Sn–Bi solder alloy, the effects of In element on the
microstructure evolution, mechanical and soldering properties were systematically …

Graphene as a reinforcement is expected to improve the shear strength of solder joint.
However, little is known about the deformation behavior and mechanisms of composite …

With the rapid iteration of microsystem integrated technology, the miniaturization of
electronic devices requires packaging materials with higher reliability. In this work, the …