Printed circuit board (PCB) is the most important part of any electronic device which is made
of copper-clad laminate and glass fiber-reinforced composites. Since the ply orientation of …

Accurately predicting warpage using finite element simulation helps accelerate decision-
making in the early product development phase. With the ongoing trend of thinning the …

The growth of the semiconductor industry is driven by the demand for electronic products
and high transistor density. However, complex manufacturing processes generate residual …

We present a thermo-mechanical characterization of organic substrates that accounts for
heterogeneity both in the in-plane and out-of-plane directions. Systematic observation of the …

Printed circuit boards (PCB) are designed and manufactured with a variety of polyamide
materials such as solder mask, metallic material such as copper trace, composite materials …

This paper presents a simulation method for the warpage that take places after the
patterning process of printed circuit boards. To conduct an efficient as well as realistic …

Laminate substrates in advanced IC packages serve as not only the principal heat
dissipation pathway but also the critical component governing the thermomechanical …

The focus of this study was to numerically predict effective thermo-mechanical properties
and substrate warpage of high-density microelectronic substrates used in organic CPU …

Compression wrinkling of composite sandwich panels with corrugated skins was
investigated numerically, analytically and experimentally. Semi-circular and sine-wave …

Printed circuit boards (PCB's) often warp when subjected to temperature changes,
associated with either the manufacturing process or the usage. In order to reduce the …