High Defect-Density Yield Learning using Three-Dimensional Logic Test Chips

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High Defect-Density Yield Learning using Three-Dimensional Logic Test Chips

Diagnosing Transition Delay Faults under Scan-Based Logic Array

DY Kang, SN Lin, KJ Lee - … Test Conference in Asia (ITC-Asia), 2022 - ieeexplore.ieee.org

This paper presents a novel diagnostic procedure for transition delay faults (TDFs) using a
two-dimensional scan-based test chip architecture. The test chip architecture consists of C …

High Defect-Density Yield Learning using Three-Dimensional Logic Test Chips

Diagnosing Transition Delay Faults under Scan-Based Logic Array

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