Temperature non-uniformity on chips has drawn the attention of researchers due to
unwanted thermal stress development on chips resulting in a reduction in their life cycle and …

Additive manufacturing has enabled the fabrication of intricate geometries and structures of
numerous sizes at high accuracy, which has attracted researchers towards its application as …

This study is motivated by the impacts of nanoparticle shapes on flow and heat transfer
characteristics in a microchannel helical heat sink for cooling of electronics in both laminar …

Metal foam heat sinks (MFHSs) are often used for electronic cooling because of their high
specific heat transfer surface area, fluid mixing capability, and lightweight. Thermal-hydraulic …

Liquid crystalline epoxy resins (LCEs) have attracted scientific attention due to their
excellent physical properties, including thermal conductivity. In this study, we report biphenyl …

Capillary-driven evaporation in porous wicks widely exists in vapor chambers, heat pipes,
etc. Porous wicks with high porosity are expected to increase critical heat flux (CHF). Here …

In the field of high-performance computing (HPC), growing power demands makes
Heterogeneous Integration (HI) the future of next-generation computing systems to sustain …

Open-cell metal foams (MFs) possess exceptional thermal conductivity and are often utilized
to enhance the phase transition efficiency of phase change materials (PCMs) that have …

Thermal performance of a heat sink having open-ring pin fins (ORPF) and cooled by
biologically synthesized silver-water nanofluid is explored in terms of first and second laws …

In this paper, the hydrothermal characteristics of direct liquid cooling in microchannel were
experimentally investigated. The effects of heat flux, inlet temperature, volume flow rate and …