Nowadays, the local heat accumulation of electronic components not only restricts the
further miniaturization and integration of electronic devices but also seriously affects the …

Abstract Two-dimensional (2D) boron nitride nanosheets (BNNS), with exceptional
thermoconductive properties and wide band gap, hold a great promise as candidate fillers …

Fabricating a high-performing thermoset using bio-based flame retardant is critical for the
sustainable development of engineering materials with superior fire safety and robust …

A phase change material is an ideal energy storage material with huge latent heat and
nearly constant phase change temperature, but there are serious problems in application …

The rapid development of high-power integrated electronic devices for 5 G system has
created an urgent requirement for thermally conductive and electrically insulating materials …

Micropatterned structures have applications in microchips, circuit board designs,
microfluidics, evaporator/condenser coils, microelectronics, metasurfaces, and other …

The development of advanced electrical equipment necessitates polymer dielectrics with a
higher electric strength. Unfortunately, this bottleneck problem has yet to be solved because …

Due to their outstanding electrical insulation performance, low energy loss and high
reliability, polymer dielectrics are widely used in flexible electronics, capacitors and large …

The rapid increase in electrical and electronic devices integration necessitates the urgent
development of epoxy composites with more reliable surface-insulating performance …

Heat dissipation involved safety issues are crucial for industrial applications of the high-
energy density battery and fast charging technology. While traditional air or liquid cooling …