In this study, the effect of epoxy based molding compound packaging on a micro-electro-
mechanical system (MEMS) pressure sensor performance is investigated. A series of …

We investigate experimentally the effects of strain on the injection of 180 domain walls
(DWs) from a nucleation pad into magnetic nanowires, as typically used for DW-based …

Photovoltaics (PV) is one major pillar in the renewable energy portfolio of wind, water,
biomass, solar thermal and geothermal power. Driven by the urgent necessity to reduce …

In the electronics industry epoxy molding compounds, underfills and adhesives are used for
the packaging of electronic components. These materials are applied in liquid form, cured at …

The anisotropy property of silicon is a basic property which has been discussed widely in the
reliability assessment of electronic components. However, the effect of silicon anisotropy on …

Thermal/residual deformations and stresses in plastic integrated circuit (IC) packages
caused by epoxy molding compound (EMC) during the manufacturing process are …

Exposed pad packages were introduced in the late 1980s and early 1990s because of their
excellent thermal and electrical performance. Despite these advantages, the exposed pad …

We propose a novel experimental method, based on a fiber Bragg grating (FBG) sensor, to
measure the elastic properties of epoxy molding compound (EMC) from a single specimen …

This paper presents our effort to predict delamination related IC & packaging reliability
problems. These reliability problems are driven by the mismatch between the different …

The linear viscoelastic properties of epoxy molding compound (EMC) are measured by an
embedded fiber Bragg grating (FBG) sensor. A single cylindrical EMC specimen is …