Molybdenum (Mo) is a promising metal contact material to replace tungsten due to its low
electrical resistivity in sub-3 nm next-generation semiconductor processes. However, the …

Chemical mechanical planarization (CMP) is indispensable for processing of integrated
circuit semiconductor devices to attain globally planarized surfaces. One of the critical …

As the popularity of mixed abrasive slurry (MAS) use in chemical mechanical planarization
(CMP) increases, analysis of number concentration and mixing ratios become increasingly …

We systematically investigate the adsorption behavior and corrosion inhibition efficacy of
pyridine carboxylic acid isomers (Picolinic, Nicotinic, Isonicotinic acids) on Cu films in …

Chemical mechanical planarization (CMP), a crucial process in semiconductor
manufacturing, raises environmental concerns due to increased waste generation …

Traditionally, the pad roughness has been maintained by wearing down the polyurethane
pad with diamond disk. However, that method generates debris and reduces pad lifetime …

Molybdenum (Mo) is a promising metal contact material to replace tungsten due to its low
electrical resistivity in sub-3nm next-generation semiconductor processes. However, the …