The formation and growth of an intermetallic compound (IMC) layer at the Sn–Ag–Cu
solder/Cu interface after laser soldering and during isothermal aging were investigated to …

In view of the recent technological as well as legislational developments, more reliability
challenges are encountered at all interconnection levels in electronic applications. With …

This study investigates the dissolution behavior of the metallic substrates Cu and Ag and the
intermetallic compound (IMC)-Ag 3 Sn in molten Sn, Sn-3.0 Ag-0.5 Cu, Sn-58Bi and Sn-9Zn …

An advanced Pb-free solder interconnect, Cu line/Cu pillar/Ni/Sn1. 8Ag/Ag/Cu lead
frame/Sn3Ag0. 5Cu/Au/Ni (P)/Cu trace, using the flip-chip quad flat no‑lead (FCQFN) …

The scope of this paper covers a comprehensive study of the lead-free Sn–Zn–Bi solder
system, on Cu, electrolytic Ni/Au and electroless Ni (P)/Au surface finishes. This includes a …

Purpose–In electronic packaging, when solid copper comes in contact with liquid solder
alloy, the former dissolves and intermetallic compounds (IMCs) form at the solid‐liquid …

Currently, Sn-Ag-Cu solders such as Sn-3.0 Ag-0.5 Cu and Sn-3.8 Ag-0.7 Cu are
considered the most promising lead-free solders for both conventional wave and reflow …

This study investigates the dissolution behavior of the Cu-2.0 wt.% Be (Alloy 25) and Cu-0.1
wt.% Fe C19210 substrates in Sn-9 wt.% Zn solder (SZ) at temperatures of 240° C, 270° C …

Using nanoindentation, this study develops the criteria to evaluate the creep performance of
the intermetallic compounds (IMCs) formed at the interface of microelectronic solder joints …

The purpose of this paper is to investigate the effect of 2 wt% Ag addition in Sn–Pb eutectic
solder on microstructure and mechanical properties of AgCu/solder/CuBe joint fabricated by …