Heat conduction by phonons is a ubiquitous process that incorporates a wide range of
physics and plays an essential role in applications ranging from space power generation to …

The thermal management challenge posed by gallium nitride (GaN) high-electron-mobility
transistor (HEMT) technology has received much attention in the past decade. The peak …

The efficiency in modern technologies and green energy solutions has boiled down to a
thermal engineering problem on the nanoscale. Due to the magnitudes of the thermal mean …

Thermal conductivity in non-metallic crystalline materials results from cumulative
contributions of phonons that have a broad range of mean free paths. Here we use high …

The thermal conductivity of n-and p-type doped gallium nitride (GaN) epilayers having
thicknesses of 3–4 μm was investigated using time domain thermoreflectance. Despite …

Dislocations, one-dimensional lattice imperfections, are common to technologically
important materials such as III–V semiconductors, and adversely affect heat dissipation in …

Strained transition layers, which are common for heteroepitaxial growth of functional
semiconductors on foreign substrates, include high defect densities that impair heat …

Interfaces play an essential role in phonon-mediated heat conduction in solids, impacting
applications ranging from thermoelectric waste heat recovery to heat dissipation in …

Cross-plane heat transport in thin films with thicknesses comparable to the phonon mean
free paths is of both fundamental and practical interest for applications such as light-emitting …

Thermal dissipation at the active region of electronic devices is a fundamental process of
considerable importance,,. Inadequate heat dissipation can lead to prohibitively large …