Interfacial reaction, shear behavior and microhardness of Cu-Sn TLP bonding joints bearing CuZnAl powder for 3D packaging
L Sun, L Zhang, Y Zhang, M Chen, C Chen - Journal of Manufacturing …, 2021 - Elsevier
The process of transient liquid phase bonding to form intermetallic compound solder joints
can effectively achieve 3D chip stack interconnection. However, there are a large number of …
can effectively achieve 3D chip stack interconnection. However, there are a large number of …
Transient liquid phase bonding for solder-a short review
The issues on the replacement of high Pb solder for high power module application has
been a major concern among researchers since Pb could caused toxicity to the …
been a major concern among researchers since Pb could caused toxicity to the …
[HTML][HTML] Ultrasonic-accelerated metallurgical reaction of Sn/Ni composite solder: Principle, kinetics, microstructure, and joint properties
W Zhang, Y Cao, J Huang, W Zhao, X Liu, M Li… - Ultrasonics …, 2020 - Elsevier
The high-melting-point joints by transient-liquid-phase are increasingly playing a crucial role
in the die bonding for the high temperature electronic components. In this study, three kinds …
in the die bonding for the high temperature electronic components. In this study, three kinds …
Precipitation transformation and strengthening mechanism of droplet ejection lightweight medium-entropy AlZnMgCuLi alloy
W Jiang, S Tao, H Qiu, S Wu, B Zhu - Journal of Alloys and Compounds, 2022 - Elsevier
Designing high-performance Al-based alloys on the basis of the entropy concept offers a
promising strategy for next-generation advanced structural materials. In this work, a high-Zn …
promising strategy for next-generation advanced structural materials. In this work, a high-Zn …
[HTML][HTML] Exceptional load-bearing capability of Al FPCB/Cu FPCB lap joints using instantaneous laser-based large area facial soldering: Experimental and numerical …
S Kim, YR Kim, E Jo, HS Lee, S Mhin, TY Lee… - Journal of Materials …, 2024 - Elsevier
This study introduces a novel method for integrating aluminum flexible printed circuit boards
(FPCBs) and copper FPCBs into battery management systems (BMS) using and …
(FPCBs) and copper FPCBs into battery management systems (BMS) using and …
Nickel–tin transient liquid phase sintering with high bonding strength for high-temperature power applications
JW Yoon, YS Kim, SE Jeong - Journal of Materials Science: Materials in …, 2019 - Springer
Abstract We performed 30Ni–70Sn (wt%) transient liquid phase sintering (TLPS) bonding
with micro-sized Ni and Sn powders for high-temperature power applications. A Ni–Sn paste …
with micro-sized Ni and Sn powders for high-temperature power applications. A Ni–Sn paste …
Microstructure and growth kinetic study in Sn–Cu transient liquid phase sintering solder paste
The feasibility of the highly reliable and replicable microstructure formation of the transient
liquid phase sintering (TLPS) paste during the early soldering and isothermal aging on the …
liquid phase sintering (TLPS) paste during the early soldering and isothermal aging on the …
Study on the Kinetics of Ni3Sn4 Growth and Isothermal Solidification in Ni-Sn TLPS Bonding Process
Y Wang, Z Ye, X Peng, J Huang, J Yang… - … Materials Transactions A, 2022 - Springer
In this work, the kinetics of Ni3Sn4 growth and the isothermal solidification kinetics in Ni-Sn
transient liquid phase sintering bonding process (TLPS bonding) were systematically …
transient liquid phase sintering bonding process (TLPS bonding) were systematically …
Growth Kinetics of Ni3Sn4 in the Solid–Liquid Interfacial Reaction
Y Wang, J Huang, Z Ye, X Peng, J Yang… - … Materials Transactions A, 2019 - Springer
A kinetic model of Ni 3 Sn 4 growth in a solid (Ni)–liquid (Sn solution saturated with Ni)
interfacial reaction was established, and a kinetic equation of l^ IMC= 0.58 ̃ D tl IMC= 0.58 …
interfacial reaction was established, and a kinetic equation of l^ IMC= 0.58 ̃ D tl IMC= 0.58 …
Tailoring thermal behavior and solid–liquid contact area of Sn/Cu composite solder during ultrasonic-assisted transient liquid phase process
Thermal behavior and phase ratios optimization are the theoretical foundations to tailor the
solder joints with high performance and high reliability. Herein, a range of Sn/Cu composite …
solder joints with high performance and high reliability. Herein, a range of Sn/Cu composite …