Moving toward an electrified world requires ultrahigh-density power converters. With the
adoption of wide-bandgap semiconductors (eg, SiC and GaN), the next-generation power …

This paper presents a virtual prototype of a power electronics switching cell realized on a 4-
layer printed circuit board (PCB) with a discrete SiC power MOSFET and a SiC Schottky …

Along with the developments in power electronic packaging technology, many studies on
design automation for MCPMs layout further push the design limits for their power density …

Moving towards an electrified world requires ultra high-density power converters. Electric
vehicles, electrified aerospace, data centers, etc. are just a few fields among wide …

Working under the NSF-sponsored POETS REU program, students are given the opportunity
to work at the University of Arkansas on advanced research projects such as the …

In recent years, the fast development of Multichip Power Modules (MCPM) packaging and
Wide Bandgap (WBG) technology has enabled higher voltage and current ratings, better …