Power modules are core components of inverters in electric vehicles and their packaging
technology has a critical impact on system performance and reliability. Conventional single …

In this paper a comprehensive review on SiC power module challenges and technology
approaches is given. These challenges originate from SiC-specific reduced chip area, from …

The paper gives an overview of the basic requirements, concepts, and trends regarding a
system integration of power electronics in hybrid (HEV) and electric vehicles (EV). A site-of …

Medium-voltage silicon carbide (SiC) power modules are a critical component in grid-bound
power conversion systems, and the packaging of these modules dictates the performance …

The tendency of increasing power rating and shrinking size of power electronics systems
requires advanced thermal management technology. Introduction of micro-channel heat sink …

Emerging wide-bandgap (WBG) semiconductor devices such as silicon carbide (SiC) metal-
oxide semiconductor field-effect transistors (MOSFETs) and gallium nitride high-electron …

A new 3-D power module dedicated to SiC mosfet is presented. It is based on printed circuit
board embedded die technology and is compared with a standard power module. After …

A single-phase, laminar flow, rectangular, and AlN-based micro-channel heat sink (MCHS)
with water coolant has been designed and optimized for power electronics packaging. By …

In recent years, there has been growing demand to increase the power density in power
modules. Therefore, the thermal management of power modules has become more and …

A stacked substrate-chip-bump-chip-substrate assembly has been demonstrated in the
construction of power switch modules with high power density and good electrical …