Imprinting “sticky” features on the surfaces of common non-sticky flexible materials, such as
paper, textile, and polymeric films produces a myriad of adhesive tapes that we use in our …

This research applied an enhanced material exfoliation and transfer mechanism to process
various pristine transition metal dichalcogenide (TMD) materials into a few-layer structure …

For future miniaturization of electronic systems using 3D chip stacking, new fine-pitch
materials for through-silicon-via (TSV) applications are likely required. In this paper, we …

Through-silicon-via (TSV) interposers using silicon and copper represent a critical element
in microelectronic packaging, as they bridge between fine-pitch inputs/outputs at the …

Owing to the great demand in more functions and miniaturization in microelectronic
packaging, the dimensions of interconnects has decreased extremely, which has resulted in …

This paper introduces a new method to reduce the crosstalk effects in copper-multiwalled
carbon nanotube (Cu-MWCNT) based heterogeneous coaxial through-silicon vias …

Through-silicon via (TSV) is a key packaging technology that facilitates the 2.5 D/3D
integration of microelectromechanical system (MEMS) devices. Among various MEMS …

Bilayer graphene is attractive for digital device applications due to the appearance of a
bandgap under application of an electrical displacement field. Controllable and fast …

This paper presents a unique method to reduce the crosstalk noise, power consumption,
power delay product (PDP) and energy delay product (EDP) in coupled multi-walled carbon …

With the excellent material properties of Carbon Nano-tubes (CNTs) developed in this work
(Coefficient of Thermal Expansion~-2 x 10-6 K-1, Resistivity~ 10-6 Ω-m, Young's modulus …